LZ-12H-K Fujitsu Components, LZ-12H-K Datasheet - Page 9

• Manufacturer Part Number: LZ-12H-K
• Manufacturer: Fujitsu Components
• Type: Power Relayr

Specifications of LZ-12H-K

• Relay Construction: Non-Latching
• Contact Arrangement: SPDT
• Coil Voltage Dc: 12V
• Coil Current: 37.5mA
• Contact Form: 1 Form C
• Voltage Rating (vdc): 150V
• Voltage Rating (vac): 250V
• Dropout Volt (min): 0.6VDCV
• Coil Resistance: 320Ohm
• Pick-up Voltage (max): 7.8VDC
• Operate Time: 7ms
• Contact Current Rating: 5A
• Coil Suppression Diode: No
• Push To Test Button: No
• Led Indicator: No
• Seal: Sealed
• Product Depth (mm): 16.4mm
• Product Length (mm): 21.4mm
• Operating Temp Range: -30C to 70C
• Pin Count: 5
• Mounting Style: Through Hole
• Termination Style: Solder Pin
• Lead Free Status / Rohs Status: Compliant

RoHS Compliance and Lead Free Information
1. General Information
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2. Recommended Lead Free Solder Profile
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3. Moisture Sensitivity
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4. Tin Whiskers
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Flow Solder condition:
Pre-heating:
Soldering:
Solder by Soldering Iron:
Soldering Iron
Temperature:
Duration:
Recommended solder Sn-3.0Ag-0.5Cu.
We highly recommend that you confirm your actual solder conditions
(Amendment to Directive 2002/95/EC)
This material has been verified to be compatible with PbSn assembly process.
Moisture Sensitivity Level standard is not applicable to electromechanical relays, unless otherwise indicated.
Dipped SnAgCu solder is known as presenting a low risk to tin whisker development. No considerable length
whisker was found by our in house test.
All signal and power relays produced by Fujitsu Components are compliant with RoHS directive 2002/95EC
Cadmium as used in electrical contacts is exempted from the RoHS directives on October 21st, 2005.
All of our signal and power relays are lead-free. Please refer to Lead-Free Status Info for older date codes
at: http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf
Lead free solder plating on relay terminals is Sn-3.0Ag-0.5Cu, unless otherwise specified.
including amendments.
maximum 120˚C
dip within 5 sec. at
260˚C solder bath
maximum 360˚C
maximum 3 sec.
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