UPG2012TK Renesas Electronics America, UPG2012TK Datasheet - Page 9

• Manufacturer Part Number: UPG2012TK
• Manufacturer: Renesas Electronics America

Specifications of UPG2012TK

• Lead Free Status / Rohs Status: Supplier Unconfirmed

RECOMMENDED SOLDERING CONDITIONS
methods and conditions other than those recommended below, contact your nearby sales office.
Infrared Reflow
VPS
Wave Soldering
Partial Heating
Caution Do not use different soldering methods together (except for partial heating).
This product should be soldered and mounted under the following recommended conditions.
Soldering Method
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (package surface temperature)
Time at temperature of 200°C or higher
Preheating time at 120 to 150°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
Data Sheet PG10219EJ02V0DS
Soldering Conditions
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
: 25 to 40 seconds
: 30 to 60 seconds
: 3 times
: 10 seconds or less
: 3 seconds or less
: 260°C or below
: 0.2%(Wt.) or below
: 215°C or below
: 0.2%(Wt.) or below
: 260°C or below
: 1 time
: 0.2%(Wt.) or below
: 350°C or below
: 0.2%(Wt.) or below
Condition Symbol
µ
WS260
VP215
HS350
For soldering
IR260
PG2012TK
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