UPC3220GR CALIFORNIA EASTERN LABS, UPC3220GR Datasheet - Page 32

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UPC3220GR

Manufacturer Part Number
UPC3220GR
Description
Manufacturer
CALIFORNIA EASTERN LABS
Datasheet

Specifications of UPC3220GR

Pin Count
16
Screening Level
Industrial
Package Type
SSOP
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPC3220GR-E1-A
Manufacturer:
NEC
Quantity:
4 000
Part Number:
UPC3220GRE1
Manufacturer:
OSRAM
Quantity:
3 864
NOTES ON CORRECT USE
RECOMMENDED SOLDERING CONDITIONS
conditions other than those recommended below, contact your nearby sales office.
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
Infrared Reflow
Wave Soldering
Partial Heating
Caution Do not use different soldering methods together (except for partial heating).
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
(3) The bypass capacitor should be attached to V
This product should be soldered and mounted under the following recommended conditions. For soldering methods and
Soldering Method
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
Soldering Conditions
CC
line.
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
: 0.2%(Wt.) or below
: 260°C or below
: 10 seconds or less
: 1 time
: 0.2%(Wt.) or below
: 350°C or below
: 3 seconds or less
: 0.2%(Wt.) or below
Condition Symbol
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
WS260
HS350
IR260
04/25/2005

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