LT5581IDDB#PBF Linear Technology, LT5581IDDB#PBF Datasheet - Page 16

• Manufacturer Part Number: LT5581IDDB#PBF
• Manufacturer: Linear Technology

Specifications of LT5581IDDB#PBF

• Pin Count: 8
• Screening Level: Industrial
• Lead Free Status / Rohs Status: Compliant

PACKAGE DESCRIPTION
2.55 ±0.05
LT5581
16
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.15 ±0.05
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
0.25 ± 0.05
0.61 ±0.05
(2 SIDES)
2.20 ±0.05
(2 SIDES)
0.50 BSC
0.70 ±0.05
PACKAGE
OUTLINE
(Reference LTC DWG # 05-08-1702 Rev B)
(SEE NOTE 6)
8-Lead Plastic DFN (3mm × 2mm)
TOP MARK
PIN 1 BAR
0.200 REF
DDB Package
3.00 ±0.10
(2 SIDES)
2.00 ±0.10
0.75 ±0.05
(2 SIDES)
0 – 0.05
R = 0.05
0.56 ± 0.05
(2 SIDES)
TYP
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
R = 0.115
TYP
4
5
2.15 ±0.05
(2 SIDES)
8
1
0.50 BSC
0.40 ± 0.10
PIN 1
R = 0.20 OR
0.25 × 45°
CHAMFER
(DDB8) DFN 0905 REV B
5581fa