SG2003DW MICROSEMI, SG2003DW Datasheet - Page 7
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SG2003DW
Manufacturer Part Number
SG2003DW
Description
Manufacturer
MICROSEMI
Datasheet
1.SG2003DW.pdf
(7 pages)
Specifications of SG2003DW
Lead Free Status / Rohs Status
Compliant
Rev 1.3b
Copyright
CONNECTION DIAGRAMS & ORDERING INFORMATION
Note 1. Contact factory for JAN and DESC product availability.
DW Package: RoHS Compliant / Pb-free Transition DC: 0516
DW Package: RoHS / Pb-free 100% Matte Tin Lead Finish
DW Package (Not Pictured) is 16-Pin Wide Body SOIC, same pinout as J package pictured above.
16-PIN PLASTIC DIP
N - PACKAGE
20-PIN CERAMIC
LEADLESS CHIP CARRIER
L- PACKAGE
16-PIN CERAMIC DIP
J - PACKAGE
Package
2. All parts are viewed from the top.
3. See selection guide for specific device types.
1997
Part No.
SG2003N
SG2023N
SG2XXXL/883B
SG2XXXL
SG2XXXJ/883B
SG2023J/DESC
JAN2001J
JAN2002J
JAN2003J
JAN2004J
SG2XXXJ
(Note 3)
Temperature Range
-55 C to 125 C
-55 C to 125 C
-55 C to 125 C
-55 C to 125 C
-55 C to 125 C
-55 C to 125 C
-55 C to 125 C
-55 C to 125 C
-55 C to 125 C
0 C to 70 C
0 C to 70 C
Ambient
7
(See Notes Below)
N Package: RoHS Compliant / Pb-free Transition DC: 0503
N Package: RoHS / Pb-free 100% Matte Tin Lead Finish
Connection Diagram
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11861 Western Avenue
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(714) 898-8121
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9
Garden Grove, CA 92841
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FAX: (714) 893-2570