TE28F160C3B110 Micron Technology Inc, TE28F160C3B110 Datasheet - Page 60

• Manufacturer Part Number: TE28F160C3B110
• Manufacturer: Micron Technology Inc

Specifications of TE28F160C3B110

• Cell Type: NOR
• Density: 16Mb
• Access Time (max): 110ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 20b
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 16b
• Number Of Words: 1M
• Supply Current: 18mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Not Compliant

Figure 21: Locking Operations Flowchart
Datasheet
60
0x01/0xD0/0x2F,
Block Address
Block Address
Lock Change
Any Address
Write either
Read Block
Lock Status
Write 0x60,
Write 0xFF
Write 0x90
Complete
Change?
Locking
Start
Yes
No
(Read Device ID)
(Lock Confirm)
(Read Array)
(Lock Setup)
LOCKING OPERATIONS PROCEDURE
Operation Command
(Optional)
(Optional)
(Optional)
Write
Write
Write
Read
Write
Bus
Idle
Lock-Down
Block Lock
Unlock, or
Device ID
Confirm
Status
Setup
Lock,
Read
None
Read
Array
Lock
Data = 0x60
Addr = Any Address
Data = 0x01 (Block Lock)
Addr = Block to lock/unlock/lock-down
Data = 0x90
Addr = Any Address
Block Lock status data
Addr = Block address + offset 2
Confirm locking change on D[1,0] .
Data = 0xFF
Addr = Any address
0xD0 (Block Unlock)
0x2F (Lock-Down Block)
Comments
C3 Discrete
March 2008
290645-24