S29GL064A10TFIR43 Spansion Inc., S29GL064A10TFIR43 Datasheet - Page 19

• Manufacturer Part Number: S29GL064A10TFIR43
• Manufacturer: Spansion Inc.

Specifications of S29GL064A10TFIR43

• Cell Type: NOR
• Density: 64Mb
• Access Time (max): 100ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 23/22Bit
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 8M/4M
• Supply Current: 50mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Compliant

6.
6.1
May 21, 2008 S29GL-A_00_A12
Ordering Information
S29GL016A Standard Products
Standard products are available in several packages and operating ranges. The order number (Valid
Combination) is formed by a combination of the following:
Notes
1. Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be packed in Types 0, 2, or 3.
2. TSOP package marking omits packing type designator from ordering part number.
3. BGA package marking omits leading S29 and packing type designator from ordering part number.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
S29GL016A
S29GL016A
Number
Device
Device Number/Description
S29GL016A
3.0 Volt-only, 16 Megabit Page-Mode Flash Memory Manufactured on 200 nm MirrorBit
Option
10
Speed
90, 10
10
10
T
S29GL016A Valid Combinations
A
& Temperature Range
D a t a
Package, Material,
I
BAI, BFI
BAI, BFI
BAI, BFI
TAI, TFI
FAI, FFI
TAI, TFI
FAI, FFI
R1
Table 6.1 S29GL016A Ordering Options
S h e e t
0
Packing Type
0 = Tray
2 = 7-inch Tape and Reel
3 = 13-inch Tape and Reel
Model Number
R1 = x8/x16, V
R2 = x8/x16, V
01 = x8/x16, Vcc = 2.7 - 3.6 V, Top boot sector device, top two address sectors protected
02 = x8/x16, Vcc = 2.7 - 3.6 V, Bottom boot sector device, bottom two address sectors
W1= x16, V
W2= x16, V
Temperature Range
I
Package Material Set
A = Standard
F = Pb-Free
Package Type
T = Thin Small Outline Package (TSOP) Standard Pinout
B = Fine-pitch Ball-Grid Array Package
F = Fortified Ball-Grid Array Package
Speed Option
See
S29GL-A
*W1 and W2 are MCP-compatible packages for cellular handsets only
= Industrial (–40°C to +85°C)
Product Selector Guide on page 9
when WP#/ACC=V
protected when WP#/ACC=V
when WP#/ACC = V
protected when WP#/ACC = V
Number
W1, W2
R1, R2
Model
01, 02
CC
CC
=2.7 – 3.6 V, 56-ball FBGA, top boot sector device*
=2.7 – 3.6 V, 56-ball FBGA, bottom boot sector device*
CC
CC
=3.0 – 3.6 V, Top boot sector device, top two address sectors protected
=3.0 – 3.6 V, Bottom boot sector device, bottom two address sectors
Type
Packing
IL
0, 2, 3
0, 2, 3
IL
0, 3
0, 3
(Note 1)
IL
IL
TS048
VBK048
LAA064
VBU056
TS048
VBK048
LAA064
and Valid Combinations below
(Note 2)
(Note 2)
(Note 3)
(Note 3)
(Note 3)
(Note 3)
(Note 3)
®
Package Description
Process Technology.
(Notes)
TSOP
Fine-Pitch BGA
Fortified BGA
Fine-Pitch BGA
(For cellular handsets only)
TSOP
Fine-Pitch BGA
Fortified BGA
19