DTC114YE ON Semiconductor, DTC114YE Datasheet - Page 4

• Manufacturer Part Number: DTC114YE
• Manufacturer: ON Semiconductor

Specifications of DTC114YE

• Transistor Polarity: NPN
• Collector-emitter Voltage: 50V
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 3
• Package Type: SOT-416
• Lead Free Status / Rohs Status: Not Compliant

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design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
function of the pad size. This can vary from the minimum
pad size for soldering to the pad size given for maximum
power dissipation. Power dissipation for a surface mount
device is determined by T
junction temperature of the die, R
from the device junction to ambient; and the operating
temperature, T
sheet, P
ratings table on the data sheet. Substituting these values into
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
should be 100°C or less.*
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference should be a maximum of 10°C.
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
Always preheat the device.
The delta temperature between the preheat and soldering
When preheating and soldering, the temperature of the
Surface mount board layout is a critical portion of the total
The power dissipation of the SOT−416/SC−90 is a
The values for the equation are found in the maximum
The melting temperature of solder is higher than the rated
Prior to placing surface mount components onto a printed
D
can be calculated as follows:
MINIMUM RECOMMENDED FOOTPRINTS FOR SURFACE MOUNTED APPLICATIONS
A
. Using the values provided on the data
P
D
Unit: mm
TYPICAL
SOLDERING PATTERN
=
T
J(max)
J(max)
R
θJA
θJA
− T
, the maximum rated
, the thermal resistance
A
SOT−416/SC−90 POWER DISSIPATION
SOLDER STENCIL GUIDELINES
SOLDERING PRECAUTIONS
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http://onsemi.com
0.5 min. (3x)
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1.4
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interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
the equation for an ambient temperature T
calculate the power dissipation of the device which in this
case is 125 milliwatts.
footprint on a glass epoxy printed circuit board to achieve a
power dissipation of 125 milliwatts. Another alternative
would be to use a ceramic substrate or an aluminum core
board such as Thermal Clad™. Using a board material such
as Thermal Clad, a higher power dissipation can be achieved
using the same footprint.
260°C for more than 10 seconds.
temperature gradient should be 5°C or less.
allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
cooling.
* Soldering a device without preheating can cause
excessive thermal shock and stress which can result in
damage to the device.
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
The soldering temperature and time should not exceed
When shifting from preheating to soldering, the maximum
After soldering has been completed, the device should be
Mechanical stress or shock should not be applied during
The 1000°C/W assumes the use of the recommended
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P
D
=
150°C − 25°C
1000°C/W
= 125 milliwatts
A
of 25°C, one can