AM29LV320DT90WMI AMD (ADVANCED MICRO DEVICES), AM29LV320DT90WMI Datasheet
AM29LV320DT90WMI
Specifications of AM29LV320DT90WMI
Related parts for AM29LV320DT90WMI
AM29LV320DT90WMI Summary of contents
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... Supplement General Description The S29AL032D in Known Good Die (KGD) form is 32 Mbit, 3.0 volt-only Flash memory. Spansion defines KGD as standard product in die form, tested for functionality and speed. Spansion KGD products have the same reliability and quality as Spansion products in packaged form. ...
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... S29AL032D Features The S29AL032D Mbit, 3.0 volt-only Flash memory organized as 4,194,304 bytes or 2,097,152 words. The word-wide data (x16) appears on DQ15–DQ0; the byte-wide (x8) data appears on DQ7–DQ0. To eliminate bus contention, the device has separate chip enable (CE#), write enable (WE#) and output enable (OE#) controls. ...
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Table of Contents General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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Electrical Specifications Refer to the S29AL032D data sheet, publication number S29AL032D_00, for full electrical specifications on the S29AL032D in KGD form. Family Part Number Speed Option (V = 2.7 – 3 Max Access Time, t (ns) ACC ...
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Pad Description 3.1 Pad Relative to Die Center See pad description relative to die center in Pad Center (mils) Pad No. Signal A15 71.057 151.857 2 A14 65.954 151.857 3 A13 60.852 151.857 4 A12 55.750 ...
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Pads Relative to V See pad description relative to V Pad Center (mils) Pad No. Signal A15 66.643 303.487 2 A14 61.540 303.487 3 A13 56.438 303.487 4 A12 51.336 303.487 5 A11 46.233 303.487 6 ...
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... D = Die with KGD test flow W = Wafer with KGD test flow SPEED OPTION Access Speed DEVICE NUMBER/DESCRIPTION S29AL032D 32 Megabit Flash Memory manufactured using 200 nm process technology 3.0 Volt-only Read, Program, and Erase S29AL032D Valid Combinations Package Type, and Temperature Range WHI, WHV, 90 ...
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Packaging Information 5.1 Surftape Packaging Direction of Feed 5.2 Waffle Pack Packaging Orientation relative to top left corner of Waffle Pack cavity plate S29AL032D Known Good Die Orientation ...
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Product Test Flow Figure 6.1 provides an overview of Spansion’s Known Good Die test flow. For more detailed information, refer to the S29AL032D product qualification database supplement for KGD. Spansion implements quality assurance procedures throughout the product test flow. ...
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Physical Specifications Description Die dimensions Die Thickness Bond Pad Size Pad Area Free of Passivation Pads Per Die Bond Pad Metalization Die Backside Passivation 8. DC Operating Conditions Description V (Supply Voltage) CC Operating Temperature 9. Manufacturing Information Description ...
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Terms and Conditions of Sale for Spansion Non-Volatile Memory Die All transactions relating to unpackaged die under this agreement shall be subject to Spansion’s standard terms and conditions of sale, or any revisions thereof, which revisions Spansion reserves the ...
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Revision History Section Revision 01 (December 20, 2006) Global Initial release. Revision 02 (July 18, 2007) Packaging Information Removed references to Gel-Pak, replaced die photo Valid Combinations Table Modified table ...
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Colophon The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated ...