GE28F320C3BD70 Intel, GE28F320C3BD70 Datasheet - Page 14

• Manufacturer Part Number: GE28F320C3BD70
• Manufacturer: Intel

Specifications of GE28F320C3BD70

• Density: 32Mb
• Access Time (max): 70ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 21b
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: VFBGA
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 16b
• Number Of Words: 2M
• Supply Current: 18mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Not Compliant

3.2
Figure 3:
Notes:
1.
2.
3.
Table 3:
Datasheet
14
Seating Plane Coplanarity
Package Body Thickness
Lead to Package Offset
Package Body Length
Package Body Width
Terminal Dimension
Lead Tip Length
Package Height
Lead Thickness
Lead Tip Angle
One dimple on package denotes Pin 1.
If two dimples, then the larger dimple denotes Pin 1.
Pin 1 will always be in the upper left corner of the package, in reference to the product mark.
Parameter
Lead Width
Lead Count
Lead Pitch
Standoff
TSOP Package Drawing and Dimensions
TSOP Package Dimensions
TSOP Package
Pin 1
Z
b
Symbol
Detail B
A1
D1
A2
A
D
N
Θ
Z
b
E
e
L
Y
c
See Detail A
See Notes 1, 2, 3 and 4
D
D
18.200
11.800
19.800
0.050
0.950
0.150
0.100
0.500
0.150
1
Min
0°
Millimeters
18.400
12.000
20.000
Detail A
1.000
0.200
0.150
0.500
0.600
0.250
Nom
48
3°
A
L
E
18.600
12.200
20.200
1.200
1.050
0.300
0.200
0.700
0.100
0.350
Max
5°
C
A
2
0
0.002
0.037
0.006
0.004
0.717
0.465
0.780
0.020
0.006
Min
Seating
Plane
0°
A
e
1
See Detail B
Y
Inches
0.0197
0.039
0.008
0.006
0.724
0.472
0.787
0.024
0.010
Nom
48
3°
C3 Discrete
March 2008
290645-24
0.047
0.041
0.012
0.008
0.732
0.480
0.795
0.028
0.004
0.014
Max
5°