RC28F256P30B85 Micron Technology Inc, RC28F256P30B85 Datasheet - Page 11

• Manufacturer Part Number: RC28F256P30B85
• Manufacturer: Micron Technology Inc

Specifications of RC28F256P30B85

• Cell Type: NOR
• Density: 256Mb
• Access Time (max): 85/17ns
• Interface Type: Parallel/Serial
• Boot Type: Bottom
• Address Bus: 24b
• Operating Supply Voltage (typ): 1.8V
• Operating Temp Range: -40C to 85C
• Package Type: EZBGA
• Program/erase Volt (typ): 1.7 to 2/8.5 to 9.5V
• Sync/async: Async/Sync
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 1.7V
• Operating Supply Voltage (max): 2V
• Word Size: 16b
• Number Of Words: 16M
• Supply Current: 28mA
• Mounting: Surface Mount
• Pin Count: 64
• Lead Free Status / Rohs Status: Not Compliant

P30
Table 6:
2.2
Figure 2:
August 2008
Order Number: 306666-12
Product Information
Lead Tip Length
Lead Count
Lead Tip Angle
Seating Plane Coplanarity
Lead to Package Offset
Notes:
1.
2.
3.
4.
E
Ball A1
Corner
A2
One dimple on package denotes Pin 1.
If two dimples, then the larger dimple denotes Pin 1.
Pin 1 will always be in the upper left corner of the package, in reference to the product mark.
Daisy Chain Evaluation Unit information is at Numonyx™ Flash Memory Packaging Technology
http://developer.Numonyx.com/design/flash/packtech.
C
D
E
G
H
A
B
F
TSOP Package Dimensions (Sheet 2 of 2)
Easy BGA Mechanical Specifications
64-Ball Easy BGA Package
1
Top View - Ball side down
A1
2
3
Symbol
4
D
N
L
ý
Y
Z
5
6
0.500
0.150
Min
0°
-
-
7
8
Millimeters
0.600
0.250
Nom
56
3°
-
A
A
B
C
D
G
H
E
F
8
0.700
0.100
0.350
Seating
Plane
Max
5°
-
Bottom View - Ball Side Up
7
6
0.020
0.006
Min
0°
5
-
-
Note: Drawing not to scale
4
Inches
3
0.024
0.010
Nom
56
3°
-
2
1
Y
S1
0.004
0.028
0.014
Max
5°
-
Ball A1
Corner
b
e
S2
Datasheet
Notes
11