AM29LV400BB-70EE Spansion Inc., AM29LV400BB-70EE Datasheet - Page 47

• Manufacturer Part Number: AM29LV400BB-70EE
• Manufacturer: Spansion Inc.

Specifications of AM29LV400BB-70EE

• Cell Type: NOR
• Density: 4Mb
• Access Time (max): 70ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 19/18Bit
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -55C to 125C
• Package Type: TSOP
• Program/erase Volt (typ): 2.7 to 3.6V
• Sync/async: Asynchronous
• Operating Temperature Classification: Military
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 512K/256K
• Supply Current: 12mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Not Compliant

REVISION SUMMARY
Revision A (January 1998)
First release.
Revision B (July 1998)
Expanded data sheet from Advanced Information to
Preliminary version.
Distinctive Characteristics
Changed “Manufactured on 0.35 µm process technol-
ogy” to “Manufactured on 0.32 µm process technology”.
General Description
Second paragraph: Changed “This device is manufac-
tured using AMD’s 0.35 µm process technology” to
“This device is manufactured using AMD’s 0.32 µm
process technology”.
Revision B+1 (August 1998)
Global
Added the 55 ns speed option.
Connection Diagrams
Corrected the orientation identifiers on the reverse
TSOP package. Changed the FBGA drawing to top
view, balls facing down.
Revision C (January 1999)
Global
Added -50R speed option.
Ordering Information
Valid Combinations: Deleted the Am29LV400BT80
and Am29LV400BB80 entries.
Erase and Programming Performance
Note 2: Changed “(3.0 V for 55R)’ to “(3.0 V for regu-
lated speed options)”.
Revision C+1 (July 2, 1999)
Global
Deleted references to the 50R speed option.
Revision D (January 3, 1999)
AC Characteristics—Figure 17. Program
Operations Timing and Figure 18. Chip/Sector
Erase Operations
Deleted t
high.
December 4, 2006 21523D4
GHWL
and changed OE# waveform to start at
D A T A
Am29LV400B
S H E E T
Physical Dimensions
Replaced figures with more detailed illustrations. The
FBGA package OPN designation is now FBA048.
Revision D+1 (November 8, 2000)
Global
Added table of contents. Deleted burn-in option from
Ordering Information section.
Revision D+2 (October 30, 2003)
Package Options
Added Lead (Pb) - Free Packaging Available option.
Special Handling Instructions for Fine Pitch Ball
Grid Array (FBGA)
Removed first sentence of second paragraph.
Standard Products - Temperature Range
Added new D, F, and K temperature ranges, and in-
cluded this new information in the valid combinations
for TSOP, SO, and FBGA Packages
DC Characteristics - CMOS Compatible
Added I
AC Characteristics - Read Operations
Modified speed options for t
AC Characteristics - Word/Byte Configuration
(BYTE#)
Modified speed options for t
BGA Capacitance
Added new table with specified information.
Trademarks
Updated.
Revision D+3 (December 13, 2005)
Global
This product has been retired and is not available for
designs. For new and current designs, S29AL004D
supersedes Am29LV400B and is the factory-recom-
m e n d e d m i g r a t i o n p a t h . P l e a s e r e fe r t o t h e
S29AL004D data sheet for specifications and ordering
information. Availability of this document is retained for
reference and historical purposes only.
Revision D4 (December 4, 2006)
AC Characteristics
Erase/Program Operations table: Changed t
maximum specification.
LR.
EHQZ
FLQZ.
and t
GHQZ
.
BUSY
to a
45