W86L387D Winbond Electronics, W86L387D Datasheet - Page 5

• Manufacturer Part Number: W86L387D
• Manufacturer: Winbond Electronics

Specifications of W86L387D

• Operating Temperature (min): 0C
• Operating Temperature Classification: Commercial
• Operating Temperature (max): 70C
• Package Type: LQFP
• Rad Hardened: No
• Lead Free Status / Rohs Status: Not Compliant

4. PIN DESCRIPTIONS
MS Interface:
Crystal Driver:
Host Interface:
36:38
44:48
7:10
PIN
1:5
40
41
33
34
15
16
17
13
14
28
35
XWRHN/
XWRLN/
D15/A0
D[13:9]
NAME
SCLK
XCSN
A[3:1]
D[8:4]
D[3:0]
XBE0
XBE1
SDIO
HCKI
XTO
D14
XTI
BS
DO/DI
DI/DO
DI/DO
DI/DO
DI/DO
DI/DO
TYPE
DO
DO
DO
DI
DI
DI
DI
DI
DI
external clock input.
also used as A0 when 8-bit Host data size.
data bus [7:0] when A0 = 1, low byte (D7:0) will accessed at data
bus [7:0] when A0 = 0.
Serial protocol bus state signal for Memory stick.
Serial protocol data signal for Memory stick.
Clock output signal for Memory stick.
From 3.58MHz to 20MHz Clock driver input signal, can be used as
Clock driver output signal.
Host clock input. Only used in Type2.
Chip select input pin, active low.
Address input pins.
Data bus D15 pin, D[15:8] is the high byte of the data bus, D15
In 8-bit mode, internal register high byte (D15:8) will accessed at
Data bus D14 pin.
Data bus [13:9] pins.
Data bus [8:4] pins, D[7:0] is the low byte of the data bus.
Data bus [3:0] pins.
Type 1:
Type 2:
Type 1:
Type 2:
High byte (D15 to D8) write control pin, active low.
Low byte (D7 to D0) write control pin, active low.
Low byte (D7 to D0) data valid pin, active low.
High byte (D15 to D8) data valid pin, active low.
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DESCRIPTION
Publication Release Date: May 13, 2005
W86L387D
Revision A1