MB3776APF-G-BND Fujitsu Components, MB3776APF-G-BND Datasheet - Page 11

• Manufacturer Part Number: MB3776APF-G-BND
• Manufacturer: Fujitsu Components

Specifications of MB3776APF-G-BND

• Lead Free Status / Rohs Status: Not Compliant

NOTES ON USE
• Take account of common impedance when designing the earth line on a printed wiring board.
• Take measures against static electricity.
• Do not apply a negative voltage
ORDERING INFORMATION
- For semiconductors, use antistatic or conductive containers.
- When storing or carrying a printed circuit board after chip mounting, put it in a conductive bag or container.
- The work table, tools and measuring instruments must be grounded.
- The worker must put on a grounding device containing 250 k
- Applying a negative voltage of 0.3 V or less to an LSI may generate a parasitic transistor, resulting in
malfunction.
MB3776APNF
MB3776APFV
Part number
MB3776APF
MB3776A-P
8-pin Plastic SSOP
8-pin Plastic SOP
8-pin Plastic SOP
8-pin Plastic DIP
(FPT-8P-M01)
(FPT-8P-M02)
(FPT-8P-M03)
(DIP-8P-M01)
Package
to 1 M resistors in series.
Remarks
MB3776A
11