5962-8872101PA Analog Devices Inc, 5962-8872101PA Datasheet - Page 20

• Manufacturer Part Number: 5962-8872101PA
• Manufacturer: Analog Devices Inc
• Type: General Purpose Amplifierr

Specifications of 5962-8872101PA

• Rail/rail I/o Type: No
• Number Of Elements: 2
• Unity Gain Bandwidth Product: 5MHz
• Slew Rate: 2.4V/us
• Common Mode Rejection Ratio: 106dB
• Single Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (typ): ±5/±9/±12/±15V
• Voltage Gain In Db: 123.52dB
• Power Supply Requirement: Dual
• Shut Down Feature: No
• Single Supply Voltage (min): Not RequiredV
• Single Supply Voltage (max): Not RequiredV
• Dual Supply Voltage (min): ±4.5V
• Dual Supply Voltage (max): ±18V
• Technology: Bipolar
• Operating Temp Range: -55C to 125C
• Operating Temperature Classification: Military
• Mounting: Through Hole
• Pin Count: 8
• Package Type: CDIP
• Lead Free Status / Rohs Status: Not Compliant

OP270
ORDERING GUIDE
Model
OP270EZ
OP270FZ
OP270GP
OP270GPZ
OP270GS
OP270GS-REEL
OP270GSZ
OP270GSZ-REEL
1
2
©2001–2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
θ
printed circuit board for SOIC package.
Z = RoHS Compliant Part.
JA
is specified for worst-case mounting conditions, that is, θ
2
2
2
T
V
75
150
250
250
A
OS
= +25°C
Max (μV)
COPLANARITY
0.30 (0.0118)
0.10 (0.0039)
0.10
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
θ
(°C/W)
12
12
37
27
D00325-0-2/10(E)
JC
Figure 50. 16-Lead Standard Small Outline Package [SOIC_W]
16
1
10.50 (0.4134)
10.10 (0.3976)
0.51 (0.0201)
0.31 (0.0122)
1.27 (0.0500)
COMPLIANT TO JEDEC STANDARDS MS-013- AA
Dimensions shown in millimeters and (inches)
θ
(°C/W)
134
134
96
92
JA
BSC
JA
is specified for device in socket for CERDIP and PDIP packages; θ
1
9
8
Rev. E | Page 20 of 20
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
7.60 (0.2992)
7.40 (0.2913)
SEATING
PLANE
2.65 (0.1043)
2.35 (0.0925)
Wide Body
(RW-16)
S-Suffix
10.65 (0.4193)
10.00 (0.3937)
0.33 (0.0130)
0.20 (0.0079)
8°
0°
Package Description
16-Lead SOIC_W
16-Lead SOIC_W
8-Lead CERDIP
8-Lead CERDIP
8-Lead PDIP
8-Lead PDIP
16-Lead SOIC_W
16-Lead SOIC_W
1.27 (0.0500)
0.40 (0.0157)
45°
JA
is specified for device soldered to
Package
Option
Q-8 (Z-Suffix)
Q-8 (Z-Suffix)
N-8 (P-Suffix)
N-8 (P-Suffix)
RW-16 (S-Suffix)
RW-16 (S-Suffix)
RW-16 (S-Suffix)
RW-16 (S-Suffix)