S29GL032M10TAIR10 AMD (ADVANCED MICRO DEVICES), S29GL032M10TAIR10 Datasheet - Page 11

• Manufacturer Part Number: S29GL032M10TAIR10
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of S29GL032M10TAIR10

• Lead Free Status / Rohs Status: Not Compliant

Note: Ball H7 is V
Special Package Handling Instructions
February 7, 2007 S29GL-M_00_B8
IO
NC*
NC*
NC*
NC*
A8
A7
A2
A1
on S29GL064M (model R5).
Special handling is required for Flash Memory products in molded packages (TSOP and BGA). The
package and/or data integrity may be compromised if the package body is exposed to tempera-
tures above 150°C for prolonged periods of time.
NC*
NC*
NC*
B8
B7
B1
RY/BY#
A13
WE#
C5
C4
C3
C2
C7
C6
A9
A7
A3
* Balls are shorted together via the substrate but not connected to the die.
WP#/ACC
RESET#
D a t a
A12
A17
D7
D6
A8
D5
D4
D3
D2
A4
S29GL-M MirrorBit
Top View, Balls Facing Down
63-Ball Fine-Pitch BGA
A14
A10
A21
A18
E7
E6
E5
E4
E3
A6
E2
A2
S h e e t
A15
A11
A19
A20
A5
A1
F7
F6
F5
F4
F3
F2
TM
DQ7
DQ5
DQ2
DQ0
A16
G7
G6
G5
G4
G3
G2
A0
Flash Family
BYTE#
DQ14
DQ12
DQ10
DQ8
CE#
H7
H6
H5
H4
H3
H2
1
DQ15/A-1
DQ13
DQ11
DQ9
OE#
V
J7
J6
J5
J4
J3
J2
CC
DQ6
DQ4
DQ3
DQ1
V
V
K7
K6
K5
K4
K3
K2
SS
SS
NC*
NC*
NC*
NC*
L8
L7
L2
L1
NC*
NC*
NC*
NC*
M8
M7
M2
M1
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