CY7C1351F-100BGC Cypress Semiconductor Corp, CY7C1351F-100BGC Datasheet

no-image

CY7C1351F-100BGC

Manufacturer Part Number
CY7C1351F-100BGC
Description
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1351F-100BGC

Lead Free Status / Rohs Status
Not Compliant
Cypress Semiconductor Corporation
Document #: 38-05210 Rev. *B
Features
1
Note:
Logic Block Diagram
1. For best–practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.
CEN
• Can support up to 133-MHz bus operations with zero
• Pin compatible and functionally equivalent to ZBT™
• Internally self-timed output buffer control to eliminate
• Registered inputs for flow-through operation
• Byte Write capability
• 128K x 36 common I/O architecture
• 2.5V / 3.3V I/O power supply
• Fast clock-to-output times
• Clock Enable (CEN) pin to suspend operation
• Synchronous self-timed writes
• Asynchronous Output Enable
• JEDEC-standard 100 TQFP and 119 BGA packages
CLK
wait states
— Data is transferred on every clock
devices
the need to use OE
— 6.5 ns (for 133-MHz device)
— 7.5 ns (for 117-MHz device)
— 8.0 ns (for 100-MHz device)
— 11.0 ns (for 66-MHz device)
A0, A1, A
ADV/LD
MODE
BW
BW
BW
BW
C
WE
CE1
CE2
CE3
ZZ
OE
A
D
B
C
CE
ADDRESS
REGISTER
READ LOGIC
SLEEP
Control
WRITE ADDRESS
AND DATA COHERENCY
4-Mb (128K x 36) Flow-through SRAM with
REGISTER
WRITE REGISTRY
CONTROL LOGIC
ADV/LD
3901 North First Street
C
A1
A0
D1
D0
BURST
LOGIC
Q1
Q0
Functional Description
The CY7C1351F is a 3.3V, 128K x 36 Synchronous
Flow-through Burst SRAM designed specifically to support
unlimited true back-to-back Read/Write operations without the
insertion of wait states. The CY7C1351F is equipped with the
advanced No Bus Latency™ (NoBL™) logic required to
enable consecutive Read/Write operations with data being
transferred on every clock cycle. This feature dramatically
improves the throughput of data through the SRAM, especially
in systems that require frequent Write-Read transitions.
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. The clock input is qualified by
the Clock Enable (CEN) signal, which when deasserted
suspends operation and extends the previous clock cycle.
Maximum access delay from the clock rise is 6.5 ns (133-MHz
device).
Write operations are controlled by the four Byte Write Select
(BW
conducted with on-chip synchronous self-timed write circuitry.
Three synchronous Chip Enables (CE
asynchronous Output Enable (OE) provide for easy bank
selection and output three-state control. In order to avoid bus
contention, the output drivers are synchronously three-stated
during the data portion of a write sequence.
• Burst Capability—linear or interleaved burst order
• Low standby power
A1'
A0'
[A:D]
DRIVERS
WRITE
) and a Write Enable (WE) input. All writes are
San Jose
MEMORY
ARRAY
NoBL™ Architecture
REGISTER
INPUT
,
CA 95134
[1]
M
N
A
S
E
S
E
P
S
E
Revised January 12, 2004
D
A
T
A
T
E
E
R
N
G
S
I
1
, CE
CY7C1351F
2
O
U
U
B
U
R
T
P
T
F
F
E
S
408-943-2600
, CE
E
3
) and an
DQs
DQP
DQP
DQP
DQP
A
B
C
D

Related parts for CY7C1351F-100BGC

CY7C1351F-100BGC Summary of contents

Page 1

... The CY7C1351F is a 3.3V, 128K x 36 Synchronous Flow-through Burst SRAM designed specifically to support unlimited true back-to-back Read/Write operations without the insertion of wait states. The CY7C1351F is equipped with the advanced No Bus Latency™ (NoBL™) logic required to enable consecutive Read/Write operations with data being transferred on every clock cycle ...

Page 2

... DQP DDQ BYTE DDQ DDQ BYTE DDQ DQP 30 D Document #: 38-05210 Rev. *B 133 MHz 117 MHz 6.5 7.5 225 220 40 40 100-lead TQFP CY7C1351F CY7C1351F 100 MHz 66 MHz Unit 8.0 11.0 ns 205 195 DQP DDQ BYTE DDQ DDQ BYTE DDQ DQP ...

Page 3

... CLK is qualified with CEN. CLK is only recognized if CEN is active LOW. E4 Input- Chip Enable 1 Input, active LOW. Sampled on the rising edge Synchronous of CLK. Used in conjunction with CE lect the device. B2 Input- Chip Enable 2 Input, active HIGH. Sampled on the rising edge Synchronous of CLK. Used in conjunction with CE the device. CY7C1351F DDQ ...

Page 4

... Power Supply Power supply inputs to the core of the device. J6 I/O Power Sup- Power supply for the I/O circuitry. ply Ground Ground for the device. N5,P5 – No Connects. Not Internally connected to the die. CY7C1351F Description and CE to select/deselect 1 2 and DQP are placed [A:D] ...

Page 5

... Byte write capability has been included in order to greatly simplify Read/Modify/Write sequences, which can be reduced to simple byte write opera- tions. Because the CY7C1351F is a common I/O device, data should , CE , not be driven into the device while the outputs are active. The ...

Page 6

... This parameter is sampled ADV/ data when OE is active. [A:D] CY7C1351F ) DD Second Third Address Address Address A1 Min. Max CYC 2t CYC 2t CYC CEN CLK L->H Three-state L->H Three-state L->H Three-state L->H Three-state L->H Data Out ( L->H Data Out ( L->H Three-state L->H Three-state L L ...

Page 7

... DQP ) C C Write Byte D– (DQ and DQP ) D D Write All Bytes Note: 9. Table only lists a partial listing of the byte write combinatios. Any combination of BW Document #: 38-05210 Rev valid. Appropriate write will be done based on which byte write is active. [A:D] CY7C1351F Page ...

Page 8

... Max, Device Deselected, DD ≥ V ≤ 0.3V, V – 0. inputs static /2), undershoot: V (AC)> -2V (Pulse width less than t CYC IL (min.) within 200ms. During this time V < CY7C1351F Ambient ) 0°C to +70°C 3.3V - 5%/+10% 2. Min. Max. 3.135 3.6 2.375 V 2.4 2.0 0.4 0.4 2.0 ...

Page 9

... MHz 3. =3.3V DDQ R = 317Ω 3.3V OUTPUT 351Ω INCLUDING JIG AND (b) SCOPE R = 1667Ω 2.5V OUTPUT =1538Ω INCLUDING JIG AND (b) SCOPE CY7C1351F Min. Max TQFP BGA Package Package 41.83 47.63 9.99 11.71 BGA TQFP Package Package ALL INPUT PULSES ...

Page 10

... SRAMs when sharing the same OELZ CHZ CLZ =3.3V and is 1.25V when V = 2.5V. DDQ CY7C1351F 133 MHz 117 MHz 100 MHz 8.5 10 3.0 4.0 3.0 4.0 6.5 7 ...

Page 11

... OEHZ BURST READ READ BURST WRITE Q(A3) Q(A4) D(A2+1) Q(A4+1) DON’T CARE UNDEFINED [19, 20, 22 Q(A2) Q(A3) STALL READ WRITE Q(A3) D(A4) DON’T CARE CY7C1351F OEV t CHZ Q(A4) Q(A4+1) D(A5) Q(A6) t DOH t OELZ WRITE READ WRITE READ D(A5) Q(A6) D(A7 ...

Page 12

... CY7C1351F-133BGC CY7C1351F-133AI CY7C1351F-133BGI 117 CY7C1351F-117AC CY7C1351F-117BGC CY7C1351F-117AI CY7C1351F-117BGI 100 CY7C1351F-100AC CY7C1351F-100BGC CY7C1351F-100AI CY7C1351F-100BGI 66 CY7C1351F-66AC CY7C1351F-66BGC CY7C1351F-66AI CY7C1351F-66BGI Shaded areas contain advance information. Please contain your local sales representative for more information on ordering these parts. Notes: 19. For this waveform ZZ is tied low. ...

Page 13

... Package Diagrams 100-Pin Thin Plastic Quad Flatpack ( 1.4 mm) A101 Document #: 38-05210 Rev. *B CY7C1351F 51-85050-*A Page ...

Page 14

... The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges. 119-Lead PBGA ( 2.4 mm) BG119 CY7C1351F 51-85115-*B Page ...

Page 15

... Document History Page Document Title: CY7C1351F 4-Mb (128K x 36) Flow-through SRAM with NoBL™ Architecture Document Number: 38-05210 REV. ECN NO. Issue Date ** 119833 01/07/03 *A 123846 01/18/03 *B 200664 See ECN Document #: 38-05210 Rev. *B Orig. of Change Description of Change HGK New Data Sheet AJH ...

Related keywords