CY62136CV33LL-55BVI Cypress Semiconductor Corp, CY62136CV33LL-55BVI Datasheet - Page 4

• Manufacturer Part Number: CY62136CV33LL-55BVI
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY62136CV33LL-55BVI

• Lead Free Status / Rohs Status: Not Compliant

Document #: 38-05199 Rev. *D
Thermal Resistance
AC Test Loads and Waveforms
Data Retention Characteristics
Data Retention Waveform
Parameter
V
I
t
t
Notes:
CCDR
CDR
R
6.
7.
DR
[7]
Parameter
[6]
Tested initially and after any design or process changes that may affect these parameters.
Full Device AC operation requires linear V
JC
JA
V
CE
CC
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
Parameters
OUTPUT
R
V
R1
R2
V
INCLUDING
TH
TH
CC
V
Data Retention Current
Chip Deselect to Data
Retention Time
Operation Recovery Time
Description
CC
JIG AND
SCOPE
30 pF
for Data Retention
Description
[6]
R1
[6]
CC
ramp from V
(Over the Operating Range)
V
Equivalent to:
t
R2
CC(min)
CDR
Still Air, soldered on a 3 x 4.5 inch, two-layer printed
circuit board
DR
Rise TIme: 1 V/ns
OUTPUT
to V
V
V
V
CC
1550
3.0V
1105
1.75
CC(min.)
645
IN
CC
GND
Typ
> V
= 1.5V CE > V
DATA RETENTION MODE
THÉ VENIN EQUIVALENT
CC
> 100 s or stable at V
Conditions
Test Conditions
– 0.2V or V
10%
V
DR
> 1.5 V
R
CC
TH
ALL INPUT PULSES
90%
IN
– 0.2V,
< 0.2V
CC(min.)
V
TH
CY62136CV30/33 MoBL
> 100 s.
1216
1374
3.3V
1.75
645
Min.
t
1.5
RC
0
90%
CY62136CV MoBL
V
10%
CC(min)
Fall Time: 1 V/ns
t
R
Typ.
1
[5]
BGA
55
16
V
Max.
ccmax
Unit
6
Page 4 of 13
V
Unit
C/W
C/W
Unit
ns
ns
V
A