5962-8959837MZA E2V, 5962-8959837MZA Datasheet - Page 48

• Manufacturer Part Number: 5962-8959837MZA
• Manufacturer: E2V

Specifications of 5962-8959837MZA

• Lead Free Status / Rohs Status: Supplier Unconfirmed

DSCC FORM 2234
APR 97
of this document.
electrical performance characteristics and post-irradiation parameter limits are as specified in table I of the body of this
document.
sufficient to make the packaged die capable of meeting the electrical performance requirements in table I.
customer, shall be identified with the wafer lot number, the certification mark, the manufacturer’s identification and the PIN
listed in 10.2 herein. The certification mark shall be a “QML” or “Q” as required by MIL-PRF-38535.
38535 listed manufacturer in order to supply to the requirements of this drawing (see 60.4 herein). The certificate of
compliance submitted to DSCC-VA prior to listing as an approved source of supply for this appendix shall affirm that the
manufacturer’s product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and the requirements herein.
shall be provided with each lot of microcircuit die delivered to this drawing.
accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The
manufacturer's modifications in the QM plan shall not effect the form, fit or function as described herein.
the manufacturer's QM plan. As a minimum it shall consist of:
(see 30.5 herein). RHA levels for device classes Q and V shall be as specified in MIL-PRF-38535. End point electrical testing
of packaged die shall be as specified in table IIA herein. Group E tests and conditions are as specified within paragraphs
4.4.4, 4.4.4.1, 4.4.4.1.1., 4.4.4.2, 4.4.4.3 and 4.4.4.4.
or as specified in the purchase order by the acquiring activity. The die carrier shall provide adequate physical, mechanical and
electrostatic protection.
C30.2.4 Assembly related information. The assembly related information shall be as specified in 10.2.4.4 and figure A-1.
C30.2.5 Truth table(s). The truth table(s) shall be as defined within paragraph 3.2.3. of the body of this document.
C30.2.6 Radiation exposure circuit. The radiation exposure circuit shall be as defined within paragraph 3.2.4. of the body
C30.3 Electrical performance characteristics and post-irradiation parameter limits. Unless otherwise specified herein, the
C30.4 Electrical test requirements. The wafer probe test requirements shall include functional and parametric testing
C30.5 Marking. As a minimum, each unique lot of die, loaded in single or multiple stack of carriers, for shipment to a
C30.6 Certification of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-
C30.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535
C40. VERIFICATION
C40.1 Sampling and inspection. For device classes Q and V, die sampling and inspection procedures shall be in
C40.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and as defined in
C40.3 Conformance inspection.
C40.3.1 Group E inspection. Group E inspection is required only for parts intended to be identified as radiation assured
C50. DIE CARRIER
C50.1 Die carrier requirements. The requirements for the die carrier shall be accordance with the manufacturer’s QM plan
a)
b)
c)
DEFENSE SUPPLY CENTER COLUMBUS
Wafer lot acceptance for Class V product using the criteria defined within MIL-STD-883 test method 5007.
100% wafer probe (see paragraph 30.4).
100% internal visual inspection to the applicable class Q or V criteria defined within MIL-STD-883 test method
2010 or the alternate procedures allowed within MIL-STD-883 test method 5004.
MICROCIRCUIT DRAWING
COLUMBUS, OHIO 43218-3990
STANDARD
FORMS A PART OF SMD 5962-89598
APPENDIX C – Continued.
SIZE
A
REVISION LEVEL
R
SHEET
5962-89598
48