MT48LC2M32B2TG-6 Micron Technology Inc, MT48LC2M32B2TG-6 Datasheet - Page 69
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MT48LC2M32B2TG-6
Manufacturer Part Number
MT48LC2M32B2TG-6
Description
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet
1.MT48LC2M32B2TG-6.pdf
(69 pages)
Specifications of MT48LC2M32B2TG-6
Organization
2Mx32
Density
64Mb
Address Bus
13b
Access Time (max)
17/7.5/5.5ns
Maximum Clock Rate
166MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
180mA
Pin Count
86
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT48LC2M32B2TG-6
Manufacturer:
MICRON
Quantity:
10
Company:
Part Number:
MT48LC2M32B2TG-6
Manufacturer:
MICRON
Quantity:
5
Part Number:
MT48LC2M32B2TG-6
Manufacturer:
MICRONAS
Quantity:
20 000
Part Number:
MT48LC2M32B2TG-6:G
Manufacturer:
MT
Quantity:
20 000
Part Number:
MT48LC2M32B2TG-6D
Manufacturer:
MICRON/美光
Quantity:
20 000
Company:
Part Number:
MT48LC2M32B2TG-6G
Manufacturer:
LT
Quantity:
4 330
Part Number:
MT48LC2M32B2TG-6G
Manufacturer:
MICRON/美光
Quantity:
20 000
Part Number:
MT48LC2M32B2TG-6IT
Manufacturer:
MICRON/美光
Quantity:
20 000
Figure 51:
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein. Although
PDF: 09005aef811ce1fe/Source: 09005aef811ce1d5
64MSDRAMx32_2.fm - Rev. J 12/08 EN
considered final, these specifications are subject to change, as further product development and data characterization sometimes occur.
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø0.42
90X Ø0.45 ±0.05
SEATING PLANE
11.20 ±0.10
0.10 C
90-Ball VFBGA (8mm x 13mm)
BALL A9
5.60 ±0.05
Notes:
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc.
C
0.65 ±0.05
1. All dimensions are in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is
3. Recommended pad size for PCB is 0.33mm ±0.025mm.
4. Topside part marking decoder can be found at:
www.micron.com/productsupport Customer Comment Line: 800-932-4992
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
3.20 ±0.05
0.025mm per side.
tools/fbga/decoder.
All other trademarks are the property of their respective owners.
8.00 ±0.10
6.40
C L
4.00 ±0.05
0.80 TYP
C L
6.50 ±0.05
0.80 TYP
BALL A1 ID
BALL A1
69
13.00 ±0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
www.micron.com/support/designsupport/
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3%Ag, 0.5% Cu
SOLDER MASK DEFINED BALL PADS: Ø0.40
SUBSTRATE MATERIAL: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
Package Dimensions
©2001 Micron Technology, Inc. All rights reserved.
64Mb: x32 SDRAM
BALL A1 ID