UPD16315GB-3BS Renesas Electronics America, UPD16315GB-3BS Datasheet
UPD16315GB-3BS
Specifications of UPD16315GB-3BS
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UPD16315GB-3BS Summary of contents
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To our customers, Old Company Name in Catalogs and Other Documents st On April 1 , 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the ...
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All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm ...
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FIP DESCRIPTION The PD16315 is a FIP (Fluorescent Indicator Panel, or Vacuum Fluorescent Display) controller/driver that is driven on a 1/4- to 1/12- duty factor. It consists of 16 segment output lines, 4 grid output lines, 8 ...
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BLOCK DIAGRAM OUT Serial interface CLK STB OSC OSC R Key data memory ( bits) Key1, Key2 2 LED 2 Command decoder Dimming circuit 24 Display memory 24 bits x 12 words Timing generator ...
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PIN CONFIGURATION (Top View) 44-pin Plastic QFP (10 x 10) LED 1 1 LED 2 2 LED 3 3 LED 4 4 OSC OUT CLK 8 STB 9 KEY 10 1 KEY 11 ...
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PIN FUNCTION Symbol Pin Name D Data input IN D Data output OUT STB Strobe CLK Clock input OSC Oscillator pin Seg /KS to High-withstanding-voltage 1 1 Seg /KS output (Segment Grid to Grid High-withstanding-voltage 1 4 ...
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DISPLAY RAM ADDRESS AND DISPLAY MODE The display RAM stores the data transmitted to the PD16315 through the serial communication. The addresses are allocated in 8-bit units. Seg Seg Seg Seg 00H 00H 01H L U ...
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KEY MATRIX AND KEY-INPUT DATA STORAGE RAM The key matrix is made matrix, as shown below. KEY 1 KEY 2 The data of each key is stored as follows, and is read with ...
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COMMANDS Commands set the display mode and status of the FIP The first 1 byte input to the PD16315 through the D is set high while commands/data are transmitted, serial communication is initialized, and the commands/data being transmitted are ...
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Data setting commands These commands set data write and data read modes. MSB Don't care Remark Power ON application, the normal operation and address increment modes are set. (3) Address setting commands These commands set an ...
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Display control commands MSB 1 0 Don't care Note Power ON application, key scanning is stopped. Remark Power ON application, the 1/16 pulse width is set and the display is turned OFF. LSB Dimming quantity ...
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KEY SCANNING AND DISPLAY TIMING 500 s T DISP DIG DIG 1 SEG output G 1 1/16T DISP Remark One cycle of key scanning consists of two frame, and data ...
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SERIAL COMMUNICATION FORMAT Reception (command/data write) STB CLK 1 Transmission (data read) STB CLK D OUT A data read command is set. Note When data is read, a ...
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ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings ( Parameter Symbol Logic Supply Voltage V DD Driver Supply Voltage V EE Logic Input Voltage V I1 FIP Driver Output Voltage V O2 LED Driver Output Current I ...
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Electrical Characteristics ( + Parameter Symbol High-Level Output Voltage V OH1 Low-Level Output Voltage V OL1 Low-Level Output Voltage V OL2 High-Level Output Current I OH21 High-Level Output Current I OH22 Driver Leakage Current ...
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Timing Conditions ( Parameter Symbol Clock Pulse Width PW CLK Strobe Pulse Width PW STB Data Setup Time t SETUP Data Hold Time t HOLD Clock-Strobe Time t CLK-STB Wait Time t WAIT ...
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Switching Characteristic Waveforms f OSC 50% OSC STB PW PW CLK CLK CLK t t SETUP HOLD OUT 90 10% t CLK-STB t t PZL PLZ t t THZ TZH Data Sheet S14074EJ1V0DS ...
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APPLICATIONS Updating display memory by incrementing address STB CLK D IN Command 1 Command 2 Command 1 : sets display mode Command 2 : sets data Command 3 : sets address Data transfers display data ...
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CIRCUIT EXAMPLE FOR APPLICATION OUT Microcontroller CLK STB + Note = Remark ...
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PACKAGE DRAWING 44-PIN PLASTIC QFP (10x10 NOTE Each lead centerline is located within 0. its true position (T.P.) at maximum material condition ...
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RECOMMENDED SOLDERING CONDITIONS The following conditions must be met for soldering conditions of the For more details, refer to the Semiconductor Device Mounting Technology Manual (C10535E). Please consult with our sales offices in case other soldering process is used, ...
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NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation ...
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Reference Documents NEC Semiconductor Device Reliability/Quality Control System (C10983E) Quality Grades On NEC Semiconductor Devices (C11531E) TM FIP is a trademark of NEC Corporation The information in this document is current as of February, 2003. The information is subject to ...