TB62726AF Toshiba, TB62726AF Datasheet
TB62726AF
Specifications of TB62726AF
Available stocks
Related parts for TB62726AF
TB62726AF Summary of contents
Page 1
... Package: Type AN: SDIP24-P-300-1.78 Type AF: SSOP24-P-300-1.00B • Current accuracy (All output ON) Current Accuracy Output Voltage Between Bits Between ICs > = 0.4 V ±4% > = 0.7 V TB62726AN TB62726AF Weight SDIP24-P-300-1.78: 1.22 g (typ.) SSOP24-P-300-1.00B: 0.32 g (typ.) = −40 to 85°C Output Current ±15 ±12 TB62726AN/AF 2006-06-14 ...
Page 2
Pin Assignment (top view) GND SERIAL-IN CLOCK LATCH OUT0 OUT1 OUT2 OUT3 OUT4 OUT5 OUT6 OUT7 Warnings: Short-circuiting an output terminal toGND or to the power supply terminal may broken the device. Please take care when wiring the output terminals, ...
Page 3
Timing Diagram CLOCK SERIAL-IN LATCH ENABLE OUT0 OUT1 OUT3 OUT15 SERIAL-OUT Warning: Latch circuit is leveled-latch circuit. Be careful because it is not triggered-latch circuit. Note 2: The latches circuit holds data ...
Page 4
Terminal Description Pin No. Pin Name 1 GND GND terminal for control logic 2 SERIAL-IN Input terminal for serial data for data shift register 3 CLOCK Input terminal for clock for data shift on rising edge Input terminal for data ...
Page 5
Absolute Maximum Ratings Characteristics Supply voltage Input voltage Output current Output voltage AN-type (when not mounted) Power dissipation AN-type (on PCB) (Note 3) AF-type (when not mounted) AF-type (on PCB) AN-type (when not mounted) Thermal resistance AN-type (on PCB) (Note ...
Page 6
Electrical Characteristics (T opr Characteristics Supply voltage Output current Output current error between bits Output leakage current input voltage Input voltage SOUT terminal voltage Output current Supply voltage Regulation Pull-up resistor Pull-down resistor Supply current = 25° 3.0 ...
Page 7
Switching Characteristics (T Characteristics Propagation delay Output rise time Output fall time Maximum CLOCK rise time Maximum CLOCK fall time Conditions: (Refer to test circuit.) = 25° opr 3 ...
Page 8
Timing Waveforms 1. CLOCK, SERIAL-IN, SERIAL-OUT CLOCK 50% t SETUP1 SERIAL-IN 50% SERIAL-OUT t pLH 2. CLOCK, SERIAL-IN, LATCH , ENABLE , OUTn CLOCK 50% SERIAL-IN LATCH ENABLE OUTn 3. OUTn OUTn t wCLK 50% 50% t HOLD 50% /t ...
Page 9
... N (On PCB) 1.8 1.6 1.4 1.2 F (On PCB) 1.0 0.8 0.6 0.4 TB62726AF 0.2 TB62726AN 0 80 100 0 20 Ambient temperature Ta (°C) 5000 10000 9 TB62726AN/AF I – DUTY On PCB OUT TB62726AF TB62726AN 100 DUTY – Turn On Rate (%) P – opr 100 2006-06-14 ...
Page 10
Application Circuit (example 1): The general composition in static lighting of LED. More than VLED (V) > (total max) + 0.7 is recommended with the following application circuit with the LED power supply VLED. r1: The setup resistance ...
Page 11
Application Circuit (example 2): When the condition of VLED is VLED > The unnecessary voltage is one effective technique as to making the voltage descend with the zenor diode. SCAN O0 SERIAL-IN ENABLE C.U. LATCH CLOCK r2 O1 ...
Page 12
Application Circuit (example 3): When the condition of VLED is Vf +0.7 < VLED < VOUT = VLED-Vf = 0.7~1 the most suitable for VOUT. Surplus VOUT causes an IC fever and the useless consumption electric ...
Page 13
Notes • Operation may become unstable due to the electromagnetic interference caused by the wiring and other phenomena. To counter this recommended that the IC be situated as close as possible to the LED module. If overvoltage is ...
Page 14
Package Dimensions Weight: 1.22 g (typ.) TB62726AN/AF 14 2006-06-14 ...
Page 15
Package Dimensions Weight: 0.32 g (typ.) TB62726AN/AF 15 2006-06-14 ...
Page 16
... Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment ...
Page 17
IC Usage Considerations Notes on Handling of ICs (1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the ...
Page 18
... TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property ...