MC14568BCP ON Semiconductor, MC14568BCP Datasheet - Page 11

• Manufacturer Part Number: MC14568BCP
• Manufacturer: ON Semiconductor

Specifications of MC14568BCP

• Operating Temperature (max): 125C
• Package Type: PDIP
• Pin Count: 16
• Mounting: Through Hole
• Lead Free Status / Rohs Status: Not Compliant

MOTOROLA CMOS LOGIC DATA
SEATING
PLANE
–T–
16
1
F
H
16
1
–A–
G
E
D
–A–
16 PL
0.25 (0.010)
F
D
9
8
16 PL
G
0.25 (0.010)
B
S
M
9
8
T
K
C
M
N
A
–B–
–T–
T
S
C
A
SEATING
PLANE
K
OUTLINE DIMENSIONS
M
CERAMIC DIP PACKAGE
PLASTIC DIP PACKAGE
J
CASE 620–10
CASE 648–08
L SUFFIX
P SUFFIX
ISSUE V
ISSUE R
L
J
16 PL
0.25 (0.010)
L
M
M
M
T
B
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
Y14.5M, 1982.
FORMED PARALLEL.
DIM
G
M
A
B
C
D
F
H
J
K
L
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
ANSI Y14.5M, 1982.
FORMED PARALLEL.
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
0.740
0.250
0.145
0.015
0.040
0.008
0.110
0.295
0.020
MIN
DIM
A
B
C
D
E
F
G
H
K
L
M
N
0.100 BSC
0.050 BSC
0
INCHES
_
0.750
0.240
0.015
0.055
0.008
0.125
0.020
MIN
0.770
0.270
0.175
0.021
0.015
0.130
0.305
0.040
–––
MAX
0.050 BSC
0.100 BSC
0.300 BSC
0.70
0
10
INCHES
_
_
0.785
0.295
0.200
0.020
0.065
0.015
0.170
0.040
MAX
18.80
15
MILLIMETERS
MIN
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0.51
2.54 BSC
1.27 BSC
_
0
_
19.05
MILLIMETERS
MIN
6.10
0.39
1.40
0.21
3.18
0.51
MAX
19.55
–––
6.85
4.44
0.53
1.77
0.38
3.30
7.74
1.01
1.27 BSC
2.54 BSC
7.62 BSC
0
10
_
_
19.93
MAX
MC14568B
7.49
5.08
0.50
1.65
0.38
4.31
1.01
15
_
11