TD62305AP Toshiba, TD62305AP Datasheet
TD62305AP
Specifications of TD62305AP
Available stocks
Related parts for TD62305AP
TD62305AP Summary of contents
Page 1
... TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62304AP,TD62304AF TD62305AP,TD62305AF 7CH LOW ACTIVE DARLINGTON SINK DRIVER The TD62304AP/AF and TD62305AP/AF are non−inverting transistor arrays, which are comprised of eight NPN darlington buffer-transistor output stages and PNP input stages. These devices can be operated by source input voltage and are ...
Page 2
... ABSOLUTE MAXIMUM RATINGS CHARACTERISTICS Supply Voltage Output Sustaining Voltage Output Current Input Voltage Input Current AP Power Dissipation AF Operating Temperature Storage Temperature Note 1: TD62305AP / AF Note 2: On glass epoxy PCB (30 × 30 × 1 50%) (Ta = 25°C) SYMBOL RATING UNIT V −0.5~7 −0.5~ (SUS) I 500 OUT − ...
Page 3
... Ta = −30~75°C for only Type−P) CHARACTERISTIC Supply Voltage Output Sustaining Voltage AP Output Current AF TD62304AP / AF Input Voltage TD62305AP / AF AP Power Dissipation AF Note 1: On glass epoxy PCB (30 × 30 × 1 50%) ELECTRICAL CHARACTERISTICS CHARACTERISTIC SYMBOL Output Leakage Current Output Saturation Voltage ...
Page 4
TEST CIRCUIT 1. I CEX (ON (ON OFF Note 1: Pulse Width 50 µs, duty cycle 10% Output impedance 50 Ω, t ≤ Note 2: ...
Page 5
... TD62304AP/AF TD62304AP/AF TD62304,305/AP/AF TD62305AP/AF TD62305AP/AF ① Type-AP Free Air ② Type-AF On Glass Epoxy PCB 30×30×1.6ｍｍ ③ Type-AF Free Air 5 2006-06-13 ...
Page 6
PACKAGE DIMENSIONS DIP16−P−300−2.54A Weight: 1.11 g (Typ.) TD62304,305/AP/AF 6 Unit : mm 2006-06-13 ...
Page 7
PACKAGE DIMENSIONS SOP16−P−225−1.27 Weight: 0.16 g (Typ.) TD62304,305/AP/AF 7 Unit : mm 2006-06-13 ...
Page 8
Notes on Contents 1. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 2. Test Circuits Components in the test circuits are used only to obtain and confirm the ...
Page 9
Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the ...
Page 10
... TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property ...