LMV242LD/AULF National Semiconductor, LMV242LD/AULF Datasheet - Page 15

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LMV242LD/AULF

Manufacturer Part Number
LMV242LD/AULF
Description
Manufacturer
National Semiconductor
Datasheet

Specifications of LMV242LD/AULF

Manufacturer's Type
Power Amplifier
Number Of Channels
1
Supply Current
12@5VmA
Frequency (max)
2GHz
Operating Supply Voltage (min)
2.6V
Operating Supply Voltage (typ)
3/5V
Operating Supply Voltage (max)
5.5V
Package Type
LLP EP
Mounting
Surface Mount
Pin Count
10
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Lead Free Status / Rohs Status
Compliant
Die / Wafer Characteristics
Physical Die Identification
Die Step
Wafer Diameter
Die Size (Drawn)
Thickness
Min Pitch
Fabrication Attributes
Physical Attributes
200 mm
889 µm x 1562 µm
35.0 mils x 61.5 mils
216 µm Nominal
123 µm Nominal
LMV242A
A
10-Pad Bare Die
15
Note: Note: Actual die size is rounded to the nearest micron
Bond Pad Opening Size (min)
Bond Pad Metallization
Passivation
Back Side Metal
Back Side Connection
20079503
General Die Information
92 µm x 92µm
0.5% Copper_Bal.
Aluminum
VOM Nitride
Bare Back
Floating
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