3-1624112-1 TE Connectivity, 3-1624112-1 Datasheet - Page 7

• Manufacturer Part Number: 3-1624112-1
• Description: INDUCTOR 8.2NH 680MA 0402
• Manufacturer: TE Connectivity
• Series: 3650, Sigma Inductorsr
• Type: -r

Specifications of 3-1624112-1

• Inductance: 8.2nH
• Current: 680mA
• Current - Saturation: -
• Current - Temperature Rise: -
• Tolerance: ±5%
• Shielding: Unshielded
• Dc Resistance (dcr): 104 mOhm Max
• Q @ Freq: 57 @ 900MHz
• Frequency - Self Resonant: 4.4GHz
• Package / Case: 0402 (1005 Metric)
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C
• Frequency - Test: 250MHz
• Material - Core: -
• Applications: High Frequency
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 3-1624112-1; 36501E8N2JTDG; A102559TR

1773163 CIS BI 06/2011
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are standard equivalents.
Type 3650 Series
Environmental Characteristics -
Mechanical Performance
Electrical Performance
Low Inductance, High Frequency Chip Inductor
Item
Vibration Test:
Resistance to
Soldering Heat:
Component Adhesion:
(Push Test)
Drop Test:
Solderability Test:
Resistance to Solvent Test:
Item
Inductance:
Q:
SRF:
DC Resistance R
Rated Current IDC:
Overload Test:
Withstanding Voltage Test:
Insulation Resistance Test:
dc
:
Specification
Appearance: No damage
ΔL ≤±5%
ΔQ ≤±10%
1 lbs. For 0402
2 lbs. For 0603
3 lbs. For the rest
After test, there shall be no
evidence of electrical or
mechanical damage
The terminal should at least
be 90% covered with solder.
There shall be no case of
deformation change in
appearance or obliteration of
marking
Specification
After test, there shall be
no evidence of electrical and
mechanical damage
After test, there shall be no
evidence of electrical and
mechanical damage.
1000M OHM MIN.
REFER to Standard Electrical
Characteristic List
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Test Method
Test device shall be soldered on the substrate
Oscillation Frequency: 10 to 55 to 10Hz for 1min
Amplitude: 1.5mm
Time: 2hrs for each axis (X, Y &Z), total 6hrs
Solder Temperature: 260±5°C
Immersion Time: 10±2sec
The device should be REFLOW soldered
(230±5°C for 10 seconds) to a tinned copper
substrate. A dynamiter force gauge should be
applied to the side of the component. The device
must with stand a minimum force of 2 or 4
pounds without a failure of the termination
attached to component.
Drop once for each face and once for each
corner. Total drop 10 Times.
Drop height :100cm
Drop weight:125g
After fluxing (alpha 100 or equiv), inductor shall
be dipped in a melted solder bath at 260±5°C
for 5 seconds.
MIL-STD202F,METHOD 215D
Test Method
HP4291B
HP4291B
HP8753D
Micro-Ohmeter (Gom-801G)
Applied the current to coils, ΔL <10%
Applied 2 times rated current for 5 minutes
Ac voltage of 500 VAC applied between inductors
terminal and case for 1 minute.
100 VDC applied between inductor terminal
and case
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