M25PE16-VMP6G Micron Technology Inc, M25PE16-VMP6G Datasheet - Page 32
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M25PE16-VMP6G
Manufacturer Part Number
M25PE16-VMP6G
Description
Manufacturer
Micron Technology Inc
Datasheet
1.M25PE16-VMP6G.pdf
(58 pages)
Specifications of M25PE16-VMP6G
Cell Type
NOR
Density
16Mb
Access Time (max)
8ns
Interface Type
Serial (SPI)
Boot Type
Not Required
Address Bus
1b
Operating Supply Voltage (typ)
3.3V
Operating Temp Range
-40C to 85C
Package Type
VFQFP
Program/erase Volt (typ)
2.7 to 3.6V
Sync/async
Synchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8b
Number Of Words
2M
Supply Current
12mA
Mounting
Surface Mount
Pin Count
8
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
M25PE16-VMP6G
Manufacturer:
ST
Quantity:
20 000
Instructions
6.9
32/58
Page write (PW)
The page write (PW) instruction allows bytes to be written in the memory. Before it can be
accepted, a write enable (WREN) instruction must previously have been executed. After the
write enable (WREN) instruction has been decoded, the device sets the write enable latch
(WEL).
The page write (PW) instruction is entered by driving Chip Select (S) Low, followed by the
instruction code, three address bytes and at least one data byte on serial data input (D). The
rest of the page remains unchanged if no power failure occurs during this write cycle.
The page write (PW) instruction performs a page erase cycle even if only one byte is
updated.
If the 8 least significant address bits (A7-A0) are not all zero, all transmitted data exceeding
the addressed page boundary roll over, and are written from the start address of the same
page (the one whose 8 least significant address bits (A7-A0) are all zero). Chip Select (S)
must be driven Low for the entire duration of the sequence.
The instruction sequence is shown in
If more than 256 bytes are sent to the device, previously latched data are discarded and the
last 256 data bytes are guaranteed to be written correctly within the same page. If less than
256 data bytes are sent to device, they are correctly written at the requested addresses
without having any effects on the other bytes of the same page.
For optimized timings, it is recommended to use the page write (PW) instruction to write all
consecutive targeted bytes in a single sequence versus using several page write (PW)
sequences with each containing only a few bytes
Chip Select (S) must be driven High after the eighth bit of the last data byte has been
latched in, otherwise the page write (PW) instruction is not executed.
As soon as Chip Select (S) is driven High, the self-timed page write cycle (whose duration is
t
check the value of the write in progress (WIP) bit. The write in progress (WIP) bit is 1 during
the self-timed page write cycle, and is 0 when it is completed. At some unspecified time
before the cycle is complete, the write enable latch (WEL) bit is reset.
A page write (PW) instruction applied to a page that is hardware or software protected is not
executed.
Any page write (PW) instruction, while an erase, program or write cycle is in progress, is
rejected without having any effects on the cycle that is in progress.
If Reset (Reset) is driven Low while a page write (PW) cycle is in progress, the page write
cycle is interrupted and the programmed data may be corrupted (see
status after a Reset Low
a time of t
(S) Low. For the value of t
DC and AC
PW
) is initiated. While the page write cycle is in progress, the status register may be read to
RHSL
parameters.
is then required before the device can be re-selected by driving Chip Select
pulse). On Reset going Low, the device enters the reset mode and
RHSL
see
Table 21: Timings after a Reset Low pulse
Figure
14.
Table 12: Device
in
Section 11:
M25PE16