XPERED-L1-R250-00801 Cree Inc, XPERED-L1-R250-00801 Datasheet - Page 12

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XPERED-L1-R250-00801

Manufacturer Part Number
XPERED-L1-R250-00801
Description
LED XLAMP XP-E RED SMD
Manufacturer
Cree Inc
Series
XP-Er
Datasheet

Specifications of XPERED-L1-R250-00801

Color
*
Current - Test
*
Luminous Flux @ Current - Test
*
Current - Max
*
Lumens @ Current - Max
*
Lumens/watt @ Current - Test
*
Voltage - Forward (vf) Typ
*
Wavelength
*
Lens Style/size
*
Viewing Angle
*
Mounting Type
*
Package / Case
*
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
XPERED-L1-R250-00801TR
REFLOW SOLDERING CHARACTERISTICS
In testing, Cree has found XLamp XP-E LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed
below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the
manufacturer of solder paste used.
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Copyright © 2008-2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
Profile Feature
Average Ramp-Up Rate (Ts
Preheat: Temperature Min (Ts
Preheat: Temperature Max (Ts
Preheat: Time (ts
Time Maintained Above: Temperature (T
Time Maintained Above: Time (t
Peak/Classification Temperature (Tp)
Time Within 5°C of Actual Peak Temperature (tp)
Ramp-Down Rate
Time 25°C to Peak Temperature
min
to ts
max
max
)
min
to Tp)
max
)
L
)
)
L
)
Lead-Based Solder
3°C/second max.
6°C/second max.
60-120 seconds
60-150 seconds
6 minutes max.
10-30 seconds
100°C
150°C
183°C
215°C
Lead-Free Solder
XLAMP XP-E LEDS
3°C/second max.
6°C/second max
60-180 seconds
60-150 seconds
8 minutes max.
20-40 seconds
150°C
200°C
217°C
260°C
12

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