UFX7000-VE Standard Microsystems (SMSC), UFX7000-VE Datasheet - Page 6

• Manufacturer Part Number: UFX7000-VE
• Description: USB 3.0 SUPER SPEED GRAPHICS CONTROLLER
• Manufacturer: Standard Microsystems (SMSC)

Revision 1.0 (12-16-10)
D/E
ccc
A1
A2
b1
A
b
e
Notes:
1. All dimensions are in millimeters.
2. Dimension “b” is measured at the maximum ball diameter, parallel to primary datum “C”.
3. Primary datum “C” (seating plane) is defined by the spherical crowns of the contact balls.
4.
5. Dimension “A” does not include attached external features, such as heat sink or chip capacitors.
6. The package ball solderable surface may be a Solder-Mask-Defined (SMD) or Non-Solder-Mask-Defined
12.90
0.25
0.65
0.40
0.35
MIN
The ball A1 identifier may vary, but is always located within the zone indicated.
(NSMD) type. For NSMD type designs, exposed copper traces are permitted outside the “b1” pad area.
-
-
NOMINAL
0.80 BSC
13.00
1.30
0.96
0.45
0.40
Table 1 225-Ball LFBGA Package Parameters
-
-
Figure 4 Recommended PCB Land Pattern
USB 3.0 Super-Speed Graphics Controller with VGA, HDMI/DVI, and Digital RGB Interfaces
PRODUCT PREVIEW
13.10
MAX
1.40
0.40
0.50
0.45
0.20
-
6
Package Ball Solderable Surface
Package Body Thickness
Overall Package Height
Overall Package Size
Ball Diameter
REMARKS
Coplanarity
Ball Pitch
Standoff
SMSC UFX7000