DG445DY Intersil, DG445DY Datasheet
DG445DY
Specifications of DG445DY
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DG445DY Summary of contents
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... MARKING RANGE (°C) PACKAGE DG444DY - SOIC DG444DYZ - SOIC (Pb-free) DG444DVZ - TSSOP (Pb-free) DG445DY - SOIC DG445DYZ - SOIC (Pb-free) DG445DVZ - TSSOP (Pb-free) Intersil (and design registered trademark of Intersil Americas Inc. PKG. DWG. # M16.15 M16.15 M16.173 M16.15 M16.15 ...
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Functional Diagrams DG444 SWITCHES SHOWN FOR LOGIC “1” ...
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... DG444, DG445 Thermal Information Thermal Resistance (Typical, Note 2) SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TSSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . Maximum Junction Temperature (Plastic Packages +150°C Maximum Storage Temperature Range . . . . . . . . . -65°C to +150°C Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp = 5V 2.4V, 0.8V (Note 3 TEMP TEST CONDITIONS = ±10V R = 1kΩ ...
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Electrical Specifications Test Conditions +15V -15V, V Unless Otherwise Specified (Continued) PARAMETER Drain OFF Leakage Current, I D(OFF) Channel ON Leakage Current D(ON) S(ON) POWER SUPPLY CHARACTERISTICS Positive Supply Current, I+ Negative Supply ...
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Test Circuits and Waveforms V is the steady state output with the switch on. Feedthrough via switch capacitance may result in spikes at the leading and trailing O edge of the output waveform. 3V LOGIC 50% INPUT 0V t OFF ...
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Test Circuits and Waveforms FIGURE 5. SOURCE/DRAIN CAPACITANCES TEST CIRCUIT Application Information +15V FET INPUT OP AMP +5V +15V -15V GAIN ...
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Typical Performance Curves SUPPLY VOLTAGE (±V) FIGURE 8. SWITCHING THRESHOLD vs SUPPLY VOLTAGE 0.1 - ...
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Typical Performance Curves +15V V- = -15V S(ON) D(ON S(OFF) D(OFF -15 - (V) A FIGURE 14. SOURCE/DRAIN CAPACITANCE vs ANALOG VOLTAGE 160 ...
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Typical Performance Curves 400 V+ = +12V 300 200 100 t OFF (V) IN FIGURE 20. SWITCHING TIME vs INPUT VOLTAGE (DG444) (SINGLE 12V SUPPLY ...
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Die Characteristics METALLIZATION: Type: SiAl ±1k Å Å Thickness: 12k Metallization Mask Layout D ( (4) GND (5) S ( DG444, DG445 PASSIVATION: Type: Nitride Thickness: 8k WORST CASE CURRENT DENSITY: 9.1 ...
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Thin Shrink Small Outline Plastic Packages (TSSOP) N INDEX 0.25(0.010) E AREA E1 - 0.05(0.002) SEATING PLANE - -C- α 0.10(0.004) 0.10(0.004 NOTES: 1. These package ...
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... Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use ...