MT48LC4M32B2B5-7 Micron Technology Inc, MT48LC4M32B2B5-7 Datasheet - Page 4

MT48LC4M32B2B5-7

Manufacturer Part Number
MT48LC4M32B2B5-7
Description
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC4M32B2B5-7

Organization
4Mx32
Density
128Mb
Address Bus
14b
Access Time (max)
17/8/5.5ns
Maximum Clock Rate
143MHz
Operating Supply Voltage (typ)
3.3V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
175mA
Pin Count
90
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT48LC4M32B2B5-7 IT:G
Manufacturer:
WINBOND
Quantity:
6
Part Number:
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Manufacturer:
Micron Technology Inc
Quantity:
10 000
Company:
Part Number:
MT48LC4M32B2B5-7 IT:G
Quantity:
1 519
Part Number:
MT48LC4M32B2B5-7 IT:G TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT48LC4M32B2B5-7:G
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT48LC4M32B2B5-7:G TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT48LC4M32B2B5-7IT
Manufacturer:
RUBYCON
Quantity:
36 000
Part Number:
MT48LC4M32B2B5-7IT:G
Manufacturer:
Micron
Quantity:
967
Part Number:
MT48LC4M32B2B5-7IT:G
Manufacturer:
MICRON23
Quantity:
787
Company:
Part Number:
MT48LC4M32B2B5-7IT:G
Quantity:
16
List of Tables
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PDF: 09005aef80872800/Source: 09005aef80863355
128MbSDRAMx32LOT.fm - Rev. L 1/09 EN
Key Timing Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Configurations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
128Mb (x32) SDRAM Part Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Ball Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Burst Definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
CAS Latency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Truth Table–Commands and DQM Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Truth Table – CKE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
Truth Table – Current State Bank n, Command To Bank n . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
Truth Table – CURRENT STATE BANK n, COMMAND TO BANK m. . . . . . . . . . . . . . . . . . . . . . . . . . . .40
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Temperature Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
Thermal Impedance Simulated Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
DC Electrical Characteristics and Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
I
Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
Electrical Characteristics and Recommended AC Operating Conditions . . . . . . . . . . . . . . . . . . . . . . .46
AC Functional Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
DD
Specifications and Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
4
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2001 Micron Technology, Inc. All rights reserved.
128Mb: x32 SDRAM
List of Tables

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