MT46V32M16FN-6 Micron Technology Inc, MT46V32M16FN-6 Datasheet - Page 14

• Manufacturer Part Number: MT46V32M16FN-6
• Manufacturer: Micron Technology Inc
• Type: DDR SDRAMr

Specifications of MT46V32M16FN-6

• Organization: 32Mx16
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 700ps
• Maximum Clock Rate: 333MHz
• Operating Supply Voltage (typ): 2.5V
• Package Type: FBGA
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 2.7V
• Operating Supply Voltage (min): 2.3V
• Supply Current: 195mA
• Pin Count: 60
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Not Compliant

Figure 9:
PDF: 09005aef80a1d9d4/Source: 09005aef82a95a3a
512Mb_DDR_x4x8x16_D2.fm - 512Mb DDR: Rev. N; Core DDR Rev. B 2/09 EN
CONDITION. THE PRE-REFLOW
SEATING PLANE
REFERS TO POST REFLOW
SOLDER BALL DIAMETER
DIAMETER IS Ø 0.40.
0.10 C
11.00
60-Ball FBGA (10mm x 12.5mm)
60X Ø
5.50 ±0.05
BALL A9
Notes:
.45
0.85 ±0.05
C
1. All dimensions are in millimeters.
2. Topside part marking decoder can be found on Micron’s Web site.
3.20 ±0.05
0.80 (TYP)
10.00 ±0.10
6.40
1.80
CTR
C L
5.00 ±0.05
C L
BALL A1
BALL A1 ID
1.00
TYP
6.25 ±0.05
12.50 ±0.10
14
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.20 MAX
512Mb: x4, x8, x16 DDR SDRAM
SOLDER BALL MATERIAL:
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3% Ag, 0.5% Cu
SOLDER BALL PAD: Ø .33
NON SOLDER MASK DEFINED
SUBSTRATE: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
BALL #1 ID
Package Dimensions
©2000 Micron Technology, Inc. All rights reserved.