LFXP15C-4FN256I Lattice, LFXP15C-4FN256I Datasheet - Page 387
LFXP15C-4FN256I
Manufacturer Part Number
LFXP15C-4FN256I
Description
IC FPGA 15.5KLUTS 188I/O 256-BGA
Manufacturer
Lattice
Datasheet
1.LFXP3C-3T100C.pdf
(397 pages)
Specifications of LFXP15C-4FN256I
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LFXP15C-4FN256I
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
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Lattice Semiconductor
256-ball caBGA BGA Breakout Examples
This BGA breakout and routing example places a MachXO PLD in a 14x14 mm, 0.8 mm pitch, 256-ball caBGA
package (LCMXO2280-B256/BN256) into two fabrication scenarios. One for a 6-layer stack up with maximum I/O
utilization and a 4-layer with about 10% fewer I/Os. The 6-layer design (Example #1), demonstrates the best use of
mechanically drill blind vias to place caps near power pins to minimize layers.
Figure 14-10. CAM Artwork Screen Shots, Example #1, 256-Ball caBGA
Layer 1 Primary
Layer 5 Signal
Layer 3 GND
14-12
Layer 6 Secondary
PCB Layout Recommendations
Layer 2 Signal
Layer 4 Power
for BGA Packages
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