LFXP10E-4FN256C Lattice, LFXP10E-4FN256C Datasheet - Page 391

• Manufacturer Part Number: LFXP10E-4FN256C
• Description: IC FPGA 9.7KLUTS 188I/O 256-BGA
• Manufacturer: Lattice

Specifications of LFXP10E-4FN256C

• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PCB Layout Recommendations
Lattice Semiconductor
for BGA Packages
pogo pin type probes are extremely small and can handle GHz range DC frequency. Zero ohm resistors are also
commonly used in first-run boards as a way to gain access to a pad or pin.
After assembly, BGA solder point quality and integrity is visually inspected with X-ray technology as part of the fab-
rication process. A special X-ray machine can look through the plastic package, substrate and silicon to directly
view the BGA solder balls, vias, traces and pads.
Figure 14-15. Example of How Defects May Appear in an X-Ray Image
The X-ray image in Figure 14-16 shows proper alignment; no voids or defects are noted. Balls, vias and traces are
visible.

Figure 14-16. X-Ray Inspection Plot of ispMACH 4000ZE 144-ball csBGA
(Photo Courtesy of CEM, Ltd., www.cemltd.com)
14-16