LFXP10C-4F256C Lattice, LFXP10C-4F256C Datasheet - Page 124
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LFXP10C-4F256C
Manufacturer Part Number
LFXP10C-4F256C
Description
IC FPGA 9.7KLUTS 188I/O 256-BGA
Manufacturer
Lattice
Datasheet
1.LFXP3C-3T100C.pdf
(397 pages)
Specifications of LFXP10C-4F256C
Lead Free Status / Rohs Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LFXP10C-4F256C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
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- Download datasheet (10Mb)
Pinout Information
Lattice Semiconductor
LatticeXP Family Data Sheet
Thermal Management
Thermal management is recommended as part of any sound FPGA design methodology. To assess the thermal
characteristics of a system, Lattice specifies a maximum allowable junction temperature in all device data sheets.
Designers must complete a thermal analysis of their specific design to ensure that the device and package do not
exceed the junction temperature limits. Refer to the Thermal Management document to find the device/package
specific thermal values.
For Further Information
For further information regarding Thermal Management, refer to the following located on the Lattice website at
www.latticesemi.com.
• Thermal Management document
• Technical Note TN1052 - Power Estimation and Management for LatticeECP/EC and LatticeXP Devices
• Power Calculator tool included with Lattice’s ispLEVER design tool, or as a standalone download from
www.latticesemi.com/software
4-56
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