PALCE16V8H5JC AMD (ADVANCED MICRO DEVICES), PALCE16V8H5JC Datasheet - Page 30

• Manufacturer Part Number: PALCE16V8H5JC
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of PALCE16V8H5JC

• Family Name: Pal®
• Process Technology: EECMOS
• # Macrocells: 8
• # I/os (max): 8
• Frequency (max): 166MHz
• Propagation Delay Time: 5ns
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (min): 4.75V
• Operating Supply Voltage (max): 5.25V
• Operating Temp Range: 0C to 75C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 20
• Package Type: PLCC
• Lead Free Status / Rohs Status: Supplier Unconfirmed

TYPICAL THERMAL CHARACTERISTICS
Measured at 25 C ambient. These parameters are not tested.
Plastic
The data listed for plastic
heat-flow paths in plastic-encapsulated devices are complex, making the
age surface. Tests indicate this measurement reference point is directly below the die-attach area on the bottom center of the package.
Furthermore,
perature. Therefore, the measurements can only be used in a similar environment.
30
jc
ja
jma
Parameter
Symbol
Registered
jc
Clock
Power
Considerations
Output
jc
Thermal impedance, junction to case
Thermal impedance, junction to ambient
Thermal impedance, junction to ambient with air flow
tests on packages are performed in a constant-temperature bath, keeping the package surface at a constant tem-
jc
are for reference only and are not recommended for use in calculating junction temperatures. The
Parameter Description
4 V
PALCE16V8 and PALCE16V8Z Families
Figure 3. Power-Up Reset Waveform
t
PR
200 lfpm air
400 lfpm air
600 lfpm air
800 lfpm air
t
WL
jc
t
measurement relative to a specific location on the pack-
S
PDID
25
71
61
55
51
47
Typ
PLCC
22
64
55
51
47
45
V
CC
16493E-12
Unit
C/W
C/W
C/W
C/W
C/W
C/W