PALCE16V8H5JC AMD (ADVANCED MICRO DEVICES), PALCE16V8H5JC Datasheet - Page 30
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PALCE16V8H5JC
Manufacturer Part Number
PALCE16V8H5JC
Description
Manufacturer
AMD (ADVANCED MICRO DEVICES)
Datasheet
1.PALCE16V8H5JC.pdf
(32 pages)
Specifications of PALCE16V8H5JC
Family Name
Pal®
Process Technology
EECMOS
# Macrocells
8
# I/os (max)
8
Frequency (max)
166MHz
Propagation Delay Time
5ns
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (min)
4.75V
Operating Supply Voltage (max)
5.25V
Operating Temp Range
0C to 75C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
20
Package Type
PLCC
Lead Free Status / Rohs Status
Supplier Unconfirmed
TYPICAL THERMAL CHARACTERISTICS
Measured at 25 C ambient. These parameters are not tested.
Plastic
The data listed for plastic
heat-flow paths in plastic-encapsulated devices are complex, making the
age surface. Tests indicate this measurement reference point is directly below the die-attach area on the bottom center of the package.
Furthermore,
perature. Therefore, the measurements can only be used in a similar environment.
30
jc
ja
jma
Parameter
Symbol
Registered
jc
Clock
Power
Considerations
Output
jc
Thermal impedance, junction to case
Thermal impedance, junction to ambient
Thermal impedance, junction to ambient with air flow
tests on packages are performed in a constant-temperature bath, keeping the package surface at a constant tem-
jc
are for reference only and are not recommended for use in calculating junction temperatures. The
Parameter Description
4 V
PALCE16V8 and PALCE16V8Z Families
Figure 3. Power-Up Reset Waveform
t
PR
200 lfpm air
400 lfpm air
600 lfpm air
800 lfpm air
t
WL
jc
t
measurement relative to a specific location on the pack-
S
PDID
25
71
61
55
51
47
Typ
PLCC
22
64
55
51
47
45
V
CC
16493E-12
Unit
C/W
C/W
C/W
C/W
C/W
C/W