2-1470209-8 TE Connectivity, 2-1470209-8 Datasheet - Page 4

Board to Board / Mezzanine Connectors RCPT 2MM 10P VRT MT 8AU 2.6ST

2-1470209-8

Manufacturer Part Number
2-1470209-8
Description
Board to Board / Mezzanine Connectors RCPT 2MM 10P VRT MT 8AU 2.6ST
Manufacturer
TE Connectivity
Datasheets

Specifications of 2-1470209-8

Product Type
Receptacles
Pitch
2 mm
Stack Height
4.5 mm
Mounting Style
Through Hole
Mounting Angle
Vertical
Number Of Positions / Contacts
10
Number Of Rows
2
Housing Material
Thermoplastic, High Temperature
Contact Material
Copper Alloy
Contact Plating
Gold (8)
Voltage Rating
200 VAC
Current Rating
1 A
Connector Type
Connector Assembly
Pcb Mount Style
Through Hole
Shrouded
No
Pcb Mount Retention
Without
Pcb Mounting Orientation
Vertical
Keyed
No
Holddown Feature
Without
Post Size (mm [in])
0.50 [.020]
Voltage (vac)
200
Contact - Rated Current (a)
1
Insulation Resistance (m?)
1,000
Termination Post Length (mm [in])
2.60 [0.102]
Solder Tail Contact Plating
Tin (80) over Nickel (50)
Centerline (mm [in])
2.00 [0.079]
Number Of Positions
10
Selectively Loaded
No
Post Number(s) Omitted
None
Centerline, Matrix (mm [in])
2.00 x 2.00 [.079 x .079]
Mount Type
Printed Circuit Board
Cover
Without
Contact Plating, Mating Area, Material
Gold (8)
Contact Base Material
Copper Alloy
Connector Style
Receptacle
Dielectric Strength (vac)
650
Ul Flammability Rating
UL 94V-0
Housing Color
Black
Housing Entry Style
Closed Top
Stack Height (mm [in])
4.50 [0.177]
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Wave solder capable to 240°C
Rohs/elv Compliance History
Always was RoHS compliant
Approved Standards
UL E28476, CSA LR7189
Temperature Range (°c)
-40 – +105
Pcb Thickness, Recommended (mm [in])
1.57 [0.062]
Packaging Method
Tray
Lead Free Status / Rohs Status
 Details
Rev
Para Ref
3.5.2.1
3.5.2.2
3.5.2.3
3.5.3.1
3.5.3.1
3.5.3.2
3.5.3.3
3.5.3.4
3.5.4.1
3.5.4.2
3.5.4.3
3.5.4.4
3.5.4.5
3.5.4.6
3.5.4.7
3.5.4.8
3.6. PRODUCT QUALIFICATION AND REQUALIFICATION TEST
3.5.1
B
(a) Numbers indicate sequence in which tests are performed.
(b) Discontinuities shall not be measured.
Examination of Product
Termination Resistance
Insulation Resistance
Dielectric Withstanding Voltage
Individual Insert Force
Individual Extraction Force
Receptacle Contact Retention Force
Post Retention Force
Solderability
Vibration
Temperature Life
Humidity, Steady State
Thermal Shock
Resistance to Soldering Heat
Durability
Salt Spray
Resistance to Soldering Heat
Test of Examination
Figure 2
1,5
2,4
A
3
1,9
2,5
3,6
4,7
B
8
1,6
2,5
C
3
4
1,5
2,4
Test Sequence (a)
D
3
Test Group
1,5
2,4
E
3
1,4
F
2
3
1,3
G
2
108-57197
1,3
H
2
1,5
2,4
3
I
4 of 5
1,3
J
2

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