ADG1206YRUZ Analog Devices Inc, ADG1206YRUZ Datasheet - Page 19

• Manufacturer Part Number: ADG1206YRUZ
• Description: IC MULTIPLEXER 16X1 28TSSOP
• Manufacturer: Analog Devices Inc
• Series: iCMOS®r
• Type: Analog Multiplexerr

Specifications of ADG1206YRUZ

• Function: Multiplexer
• Circuit: 1 x 16:1
• On-state Resistance: 270 Ohm
• Voltage Supply Source: Dual Supply
• Voltage - Supply, Single/dual (±): ±14 V ~ 16 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 28-TSSOP (0.173", 4.40mm Width)
• No. Of Circuits: 1
• Supply Current: 260µA
• On State Resistance Max: 120ohm
• Supply Voltage Range: 10.8V To 13.2V, ± 13.5V To ± 16.5V
• Operating Temperature Range: -40°C To +125°C
• Multiplexer Configuration: Single 16:1
• Number Of Inputs: 16
• Number Of Outputs: 1
• Number Of Channels: 1
• Analog Switch On Resistance: 475@10.8VOhm
• Analog Switch Turn On Time: 100ns
• Analog Switch Turn Off Time: 110ns
• Package Type: TSSOP
• Power Supply Requirement: Single/Dual
• Single Supply Voltage (min): 5V
• Single Supply Voltage (typ): 12V
• Single Supply Voltage (max): 16.5V
• Dual Supply Voltage (min): ±5V
• Dual Supply Voltage (typ): ±15V
• Dual Supply Voltage (max): ±16.5V
• Mounting: Surface Mount
• Pin Count: 28
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: Q2936649

OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADG1206YRUZ
ADG1206YRUZ-REEL7
ADG1206YCPZ-REEL7
ADG1207YRUZ
ADG1207YRUZ-REEL7
ADG1207YCPZ-REEL7
1
Z = RoHS Compliant Part.
1
1
1
1
1
1
INDICATOR
1.00
0.85
0.80
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
PIN 1
12° MAX
SEATING
PLANE
0.15
0.05
COPLANARITY
PIN 1
0.10
Figure 40. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
BSC SQ
Figure 39. 28-Lead Thin Shrink Small Outline Package [TSSOP]
VIEW
2 8
TOP
5.00
1
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
0.80 MAX
0.65 TYP
0.30
0.23
0.18
0.30
0.19
COMPLIANT TO JEDEC STANDARDS MO-153-AE
0.65
BSC
5 mm × 5 mm Body, Very Thin Quad
Dimensions shown in millimeters
Dimensions shown in millimeters
9.80
9.70
9.60
Description
28-Lead Thin Shrink Small Outline Package [TSSOP]
28-Lead Thin Shrink Small Outline Package [TSSOP]
32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
28-Lead Thin Shrink Small Outline Package [TSSOP]
28-Lead Thin Shrink Small Outline Package [TSSOP]
32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
BSC SQ
4.75
0.20 REF
Rev. A | Page 19 of 20
1.20 MAX
SEATING
0.05 MAX
0.02 NOM
(CP-32-2)
PLANE
(RU-28)
1 4
1 5
0.60 MAX
COPLANARITY
BSC
0.50
0.40
0.30
0.50
0.20
0.09
4.50
4.40
4.30
0.08
6.40 BSC
24
17
16
25
(BOTTOM VIEW)
0.60 MAX
8 °
0 °
EXPOSED
PAD
0.75
0.60
0.45
32
9
1
8
3.50 REF
3.25
3.10 SQ
2.95
0.25 MIN
PIN 1
INDICATOR
ADG1206/ADG1207
Package Option
RU-28
RU-28
CP-32-2
RU-28
RU-28
CP-32-2