ADG508FBRNZ Analog Devices Inc, ADG508FBRNZ Datasheet - Page 17

• Manufacturer Part Number: ADG508FBRNZ
• Description: IC MULTIPLEXER 8X1 16SOIC
• Manufacturer: Analog Devices Inc
• Type: Analog Multiplexerr

Specifications of ADG508FBRNZ

• Function: Multiplexer
• Circuit: 1 x 8:1
• On-state Resistance: 300 Ohm
• Voltage Supply Source: Dual Supply
• Voltage - Supply, Single/dual (±): ±10.8 V ~ 16.5 V
• Current - Supply: 20µA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• No. Of Circuits: 1
• Supply Current: 600µA
• On State Resistance Max: 300ohm
• Supply Voltage Range: 10.8V To 16.5V
• Operating Temperature Range: -40°C To +85°C
• Analog Switch Case Style: SOIC
• Package: 16SOIC N
• Maximum On Resistance: 350@±15V Ohm
• Maximum Propagation Delay Bus To Bus: 300@±15V ns
• Maximum High Level Output Current: 20 mA
• Multiplexer Architecture: 8:1
• Maximum Turn-on Time: 250@±15V ns
• Power Supply Type: Dual
• Multiplexer Configuration: Single 8:1
• Number Of Inputs: 8
• Number Of Outputs: 1
• Number Of Channels: 1
• Analog Switch On Resistance: 350@±15VOhm
• Analog Switch Turn On Time: 250ns
• Analog Switch Turn Off Time: 250ns
• Package Type: SOIC N
• Power Supply Requirement: Dual
• Single Supply Voltage (min): Not RequiredV
• Single Supply Voltage (typ): Not RequiredV
• Single Supply Voltage (max): Not RequiredV
• Dual Supply Voltage (typ): ±15V
• Dual Supply Voltage (max): ±22V
• Power Dissipation: 3.3mW
• Mounting: Surface Mount
• Pin Count: 16
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

0.048 (1.22)
0.042 (1.07)
(0.51)
0.020
R
0.048 (1.22 )
0.042 (1.07)
0.15
0.05
4
8
4.50
4.40
4.30
PIN 1
0.395 (10.03)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
0.356 (9.04)
0.350 (8.89)
0.385 (9.78)
(PINS DOWN)
3
9
TOP VIEW
IDENTIFIER
Figure 39. 16-Lead Thin Shrink Small Outline Package [TSSOP]
BSC
0.65
PIN 1
16
Figure 38. 20-Lead Plastic Leaded Chip Carrier [PLCC]
1
COPLANARITY
19
13
Dimensions shown in inches and (millimeters)
SQ
COMPLIANT TO JEDEC STANDARDS MO-047-AA
SQ
COMPLIANT TO JEDEC STANDARDS MO-153-AB
18
14
5.10
5.00
4.90
0.10
0.056 (1.42)
0.042 (1.07)
Dimensions shown in millimeters
0.050
(1.27)
BSC
0.30
0.19
9
8
Rev. E | Page 17 of 20
1.20
MAX
SEATING
PLANE
BSC
6.40
0.180 (4.57)
0.165 (4.19)
0.120 (3.04)
0.090 (2.29)
(RU-16)
(P-20)
0.20
0.09
0.032 (0.81)
0.026 (0.66)
0.021 (0.53)
0.013 (0.33)
0.20 (0.51)
MIN
0.045 (1.14)
0.025 (0.64)
8°
0°
0.330 (8.38)
0.290 (7.37)
R
0.020 (0.50)
ADG508F/ADG509F/ADG528F
R
0.75
0.60
0.45
BOTTOM
(PINS UP)
VIEW