ADG408BNZ Analog Devices Inc, ADG408BNZ Datasheet - Page 4

• Manufacturer Part Number: ADG408BNZ
• Description: IC MULTIPLEXER 8X1 16DIP
• Manufacturer: Analog Devices Inc
• Series: LC²MOSr
• Type: Analog Multiplexerr

Specifications of ADG408BNZ

• Function: Multiplexer
• Circuit: 1 x 8:1
• On-state Resistance: 100 Ohm
• Voltage Supply Source: Single Supply
• Voltage - Supply, Single/dual (±): 5V, 12V
• Current - Supply: 100µA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• No. Of Circuits: 1
• Supply Current: 100µA
• On State Resistance Max: 40ohm
• Supply Voltage Range: 12V, ± 15V
• Operating Temperature Range: -40°C To +85°C
• Analog Switch Case Style: DIP
• No. Of Pins: 16
• Multiplexer Configuration: Single 8:1
• Number Of Inputs: 8
• Number Of Outputs: 1
• Number Of Channels: 1
• Analog Switch On Resistance: 100@±15VOhm
• Analog Switch Turn On Time: 150ns
• Analog Switch Turn Off Time: 60ns
• Package Type: PDIP
• Power Supply Requirement: Single/Dual
• Single Supply Voltage (min): 5V
• Single Supply Voltage (typ): 12V
• Single Supply Voltage (max): 12V
• Dual Supply Voltage (typ): ±15V
• Dual Supply Voltage (max): ±22V
• Power Dissipation: 470mW
• Mounting: Through Hole
• Pin Count: 16
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Amplifier Type: Analog Multiplexer
• Capacitance, Drain Off: 40 pF (Typ.)
• Capacitance, Drain On: 54 pF (Typ.)
• Capacitance, Source Off: 11 pF (Typ.)
• Current, Leakage, Drain-off: ±1 nA (Max.) @ +25 °C
• Current, Leakage, Drain-on: ±1 nA (Max.) @ +25 °C
• Resistance, Drain To Source On: 40 Ohms (Typ.) @ +25 °C
• Temperature, Operating, Maximum: 85 °C
• Temperature, Operating, Minimum: -40 °C
• Time, Transistion: 120 ns (Typ.)
• Time, Turn-off Enable: 65 ns (Typ.)
• Time, Turn-on Enable: 125 ns (Typ.)
• Voltage, Input, Logic High: 2.4 V (Min.)
• Voltage, Supply: 44 V (Max.)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

ADG408/ADG409
ABSOLUTE MAXIMUM RATINGS
(T
V
V
V
Analog, Digital Inputs
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 20 mA
Peak Current, S or D
Operating Temperature Range
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150∞C
CERDIP Package, Power Dissipation . . . . . . . . . . . . 900 mW
PDIP Package, Power Dissipation . . . . . . . . . . . . . . . 470 mW
TSSOP Package, Power Dissipation . . . . . . . . . . . . . 450 mW
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 600 mW
NOTES
1
2
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG408/ADG409 feature proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high energy electrostatic discharges. Therefore,
proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Stresses above those listed under Absolute Maximum Ratings may cause per-
manent damage to the device. This is a stress rating only; functional operation
of the device at these or any other conditions above those listed in the opera-
tional sections of this specification is not implied. Exposure to absolute maxi-
mum rating conditions for extended periods may affect device reliability. Only
one absolute maximum rating may be applied at any one time.
Overvoltages at A, EN, S, or D will be clamped by internal diodes. Current
should be limited to the maximum ratings given.
DD
DD
SS
A
(Pulsed at 1 ms, 10% Duty Cycle max) . . . . . . . . . . . 40 mA
Industrial (B Version) . . . . . . . . . . . . . . . . –40∞C to +85∞C
Extended (T Version) . . . . . . . . . . . . . . . –55∞C to +125∞C
Storage Temperature Range . . . . . . . . . . . –65∞C to +150∞C
q
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . 300∞C
q
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . 260∞C
q
q
q
Lead Temperature, Soldering
JA
JA
JA
JC
JA
= 25∞C, unless otherwise noted.)
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –25 V
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215∞C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220∞C
to V
to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +25 V
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 76∞C/W
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 117∞C/W
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 155∞C/W
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 50∞C/W
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 77∞C/W
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 V
2
. . . V
SS
– 2 V to V
1
Whichever Occurs First
DD
+ 2 V or 20 mA,
–4–
Model
ADG408BN
ADG408BR
ADG408BRU
ADG408TQ
ADG409BN
ADG409BR
ADG409BRU
ADG409TQ
NOTES
1
2
To order MIL-STD-883, Class B processed parts, add /883B to T grade part
N = PDIP; Q = CERDIP; R = 0.15" Small Outline IC (SOIC);
numbers.
RU = Thin Shrink Small Outline Package (TSSOP).
1
Temperature Range
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–55∞C to +125∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–55∞C to +125∞C
ORDERING GUIDE
Package Option
N-16
R-16A
RU-16
Q-16
N-16
R-16A
RU-16
Q-16
REV. B
2