DC1198A-A Linear Technology, DC1198A-A Datasheet - Page 19

• Manufacturer Part Number: DC1198A-A
• Description: BOARD EVAL LTM4605
• Manufacturer: Linear Technology
• Series: µModuler

Specifications of DC1198A-A

• Design Resources: LTM4605 Spice Model LTM460(5,7) Gerber Files DC1198 Design Files DC1198A-(A,B) Schematic
• Main Purpose: DC/DC, Step Up or Down
• Outputs And Type: 1, Non-Isolated
• Power - Output: -
• Voltage - Output: 12V
• Current - Output: 5A
• Voltage - Input: 4.5 ~ 20V
• Regulator Topology: Buck-Boost
• Frequency - Switching: 300kHz
• Board Type: Fully Populated
• Utilized Ic / Part: LTM4605
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

APPLICATIONS INFORMATION
Layout Checklist/Example
The high integration of LTM4605 makes the PCB board
layout very simple and easy. However, to optimize its electri-
cal and thermal performance, some layout considerations
are still necessary.
• Use large PCB copper areas for high current path, includ-
• Place high frequency input and output ceramic capaci-
• Route SENSE
ing V
minimize the PCB conduction loss and thermal stress.
tors next to the V
high frequency noise
PC trace spacing. Avoid sense lines passing through
noisy areas, such as switch nodes.
IN
, R
SENSE
–
and SENSE
, SW1, SW2, PGND and V
IN
, PGND and V
+
leads together with minimum
SW1
V
PGND
OUT
C
OUT
OUT
pins to minimize
OUT
Figure 13. Recommended PCB Layout
. It helps to
KELVIN CONNECTIONS TO R
+
L1
–
R
SENSE
SGND
SW2
• Place a dedicated power ground layer underneath the
• To minimize the via conduction loss and reduce module
• Do not put vias directly on pads, unless the vias are
• Use a separated SGND ground copper area for com-
Figure 13. gives a good example of the recommended
layout.
unit.
thermal stress, use multiple vias for interconnection
between the top layer and other power layers
capped.
ponents connected to signal pins. Connect the SGND
to PGND underneath the unit.
V
SENSE
IN
R
SENSE
PGND
C
IN
4605 F13
LTM4605
19
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