SI2438FT18-EVB Silicon Laboratories Inc, SI2438FT18-EVB Datasheet - Page 120
![no-image](/images/manufacturer_photos/0/6/609/silicon_laboratories_inc_sml.jpg)
SI2438FT18-EVB
Manufacturer Part Number
SI2438FT18-EVB
Description
BOARD EVAL SI2438+SI3018 24PIN
Manufacturer
Silicon Laboratories Inc
Datasheet
1.SI3050-E-FM.pdf
(128 pages)
Specifications of SI2438FT18-EVB
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- Current page: 120 of 128
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Si3050 + Si3011/18/19
14.1. PCB Land Pattern: Si3011/18/19 TSSOP
120
Table 35. 16-Pin Thin Shrink Small Outline Package (TSSOP) PCB Land Patten Dimensions
Figure 61. 16-Pin Thin Shrink Small Outline Package (TSSOP) PCB Land Pattern
Dimension
Notes:
1. This Land Pattern Design is based on IPC-7351
2. All feature sizes shown are at Maximum Material Condition
C1
X1
Y1
specifications for Density Level B (Median Land Protrusion).
(MMC) and a card fabrication tolerance of 0.05 mm is
assumed.
E
Pad Column Spacing
Pad Row Pitch
Pad Width
Pad Length
Feature
Rev. 1.4
(mm)
5.80
0.65
0.45
1.40
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