ADG633YRUZ Analog Devices Inc, ADG633YRUZ Datasheet - Page 14

no-image

ADG633YRUZ

Manufacturer Part Number
ADG633YRUZ
Description
IC SWITCH TRIPLE SPDT 16TSSOP
Manufacturer
Analog Devices Inc
Datasheet

Specifications of ADG633YRUZ

Function
Switch
Circuit
3 x SPDT
On-state Resistance
75 Ohm
Voltage Supply Source
Single, Dual Supply
Voltage - Supply, Single/dual (±)
2 V ~ 12 V, ±2 V ~ 6 V
Current - Supply
0.01µA
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
16-TSSOP (0.173", 4.40mm Width)
Analog Switch Type
SPDT
No. Of Channels
3
Bandwidth
580MHz
On State Resistance Max
85ohm
Turn Off Time
25ns
Turn On Time
70ns
Supply Voltage Range
2V To 12V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ADG633YRUZ
Manufacturer:
AD
Quantity:
1
Part Number:
ADG633YRUZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
ADG633
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADG633YRU
ADG633YRU-REEL7
ADG633YRUZ
ADG633YRUZ-REEL7
ADG633YCP
ADG633YCP-REEL7
ADG633YCPZ
ADG633YCPZ-REEL7
1
Z = RoHS Compliant Part.
1
1
1
1
−40°C to +125°C
−40°C to +125°C
−40°C to +85°C
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
INDICATOR
1.00
0.85
0.80
PIN 1
0.15
0.05
12° MAX
SEATING
PLANE
4.50
4.40
4.30
PIN 1
Figure 31. 16-Lead Thin Shrink Small Outline Package [TSSOP]
BSC
0.65
BSC SQ
Figure 32. 16-Lead Frame Chip Scale Package [LFCSP_VQ]
VIEW
4.00
16
TOP
1
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
COPLANARITY
0.80 MAX
0.65 TYP
COMPLIANT TO JEDEC STANDARDS MO-153-AB
0.35
0.30
0.25
5.10
5.00
4.90
0.10
4 mm × 4 mm Body, Very Thin Quad
Dimensions shown in millimeters
Dimensions shown in millimeters
Package Description
16-Lead Thin Shrink Small Outline Package (TSSOP)
16-Lead Thin Shrink Small Outline Package (TSSOP)
16-Lead Thin Shrink Small Outline Package (TSSOP)
16-Lead Thin Shrink Small Outline Package (TSSOP)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
0.30
0.19
BSC SQ
0.20 REF
3.75
9
8
Rev. A | Page 14 of 16
1.20
MAX
SEATING
PLANE
0.05 MAX
0.02 NOM
BSC
6.40
(CP-16-4)
(RU-16)
0.65 BSC
COPLANARITY
0.60 MAX
0.20
0.09
0.75
0.60
0.50
0.08
12
9
13
8
(BOTTOM VIEW)
1.95 BSC
0.60 MAX
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
16
5
1
4
0.25 MIN
0.75
0.60
0.45
PIN 1
INDICATOR
Package Option
RU-16
RU-16
RU-16
RU-16
CP-16-4
CP-16-4
CP-16-4
CP-16-4

Related parts for ADG633YRUZ