MT9HTF12872AZ-667H1 Micron Technology Inc, MT9HTF12872AZ-667H1 Datasheet

MT9HTF12872AZ-667H1

Manufacturer Part Number

MT9HTF12872AZ-667H1

Description

MODULE DDR2 SDRAM 1GB 240UDIMM

Manufacturer

Micron Technology Inc

Series

-r

Datasheet

1.MT9HTF12872AZ-667H1.pdf (16 pages)

Specifications of MT9HTF12872AZ-667H1

Memory Type

DDR2 SDRAM

Memory Size

1GB

Speed

667MT/s

Features

Package / Case

240-UDIMM

Lead Free Status / Rohs Status

Lead free / RoHS Compliant

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DDR2 SDRAM FBDIMM

MT9HTF6472F – 512MB

MT9HTF12872F – 1GB

For the component data sheet, refer to Micron’s Web site:

Features

• 240-pin, DDR2 fully-buffered dual in-line memory

• Fast data transfer rates: PC2-4200, PC2-5300, or

• 512MB (64 Meg x 72), 1GB (128 Meg x 72)

• 3.2 Gb/s, 4.0 Gb/s, and 4.8 Gb/s link transfer rates

• High-speed, 1.5V differential, point-to-point link

• Fault tolerant; can work around a bad bit lane in

• High-density scaling with up to eight FBDIMMs per

• SMBus interface to AMB for configuration register

• In-band and out-of-band command access

• Deterministic protocol

• Automatic DDR2 SDRAM bus and channel

• Transmitter de-emphasis to reduce ISI

• MBIST and IBIST test functions

• Transparent mode for DRAM test support

Table 1:

PDF: 09005aef81a2f1eb/Source: 09005aef81a2f20c

HTF9C64_128x72F.fm - Rev. B 9/07 EN

module (FBDIMM)

PC2-6400

between the host controller and advanced memory

buffer (AMB)

each direction

channel

access

– Enables memory controller to optimize DRAM

– Delivers precise control and repeatable memory

calibration

Speed

Grade

-80E

-667

-53E

accesses for maximum performance

behavior

Key Timing Parameters

Industry Nomenclature

Products and specifications discussed herein are subject to change by Micron without notice.

PC2-6400

PC2-5300

PC2-4200

CL = 5

800

667

512MB, 1GB (x72, SR) 240-Pin DDR2 SDRAM FBDIMM

–

Data Rate (MT/s)

www.micron.com

CL = 4

533

Figure 1:

Features (continued)

• V

• Serial presence-detect (SPD) with EEPROM

• Gold edge contacts

• Single rank

• Supports 95°C operation with 2X refresh

Notes: 1. Not recommended for new designs.

PCB height: 30.35mm (1.19in)

Options

• Package

• Frequency/CAS latency

termination

– 240-pin DIMM (Pb-free)

– 2.5ns @ CL = 5 (DDR2-800)

– 3.0ns @ CL = 5 (DDR2-667)

– 3.75ns @ CL = 4 (DDR2-533)

REF

DDSPD

Micron Technology, Inc., reserves the right to change products or specifications without notice.

= 1.5V for AMB

= V

= 0.9V SDRAM command and address

= +3.0V to +3.6V for AMB and EEPROM

CL = 3

400

Q = +1.8V for DRAM

–

240-Pin FBDIMM (MO-256 R/C A)

(ns)

12.5

RCD

(ns)

12.5

Marking

Features

-80E

-667

-53E

(ns)

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