SEN02G64C4BF2SA-30WR Swissbit NA Inc, SEN02G64C4BF2SA-30WR Datasheet - Page 13

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SEN02G64C4BF2SA-30WR

Manufacturer Part Number
SEN02G64C4BF2SA-30WR
Description
DRAM DDR2 2GB 200-SODIMM
Manufacturer
Swissbit NA Inc
Series
-r
Datasheet

Specifications of SEN02G64C4BF2SA-30WR

Memory Type
DDR2 SDRAM
Memory Size
2GB
Speed
667MHz
Features
-
Package / Case
200-SODIMM
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
1052-1042
SERIAL PRESENCE-DTECT MATRIX (continued)
Part Number Code
Swissbit AG
Swissbit AG
Industriestrasse 4
CH-9552 Bronschhofen
* optional / additional information
99-127 MANUFACTURER-SPECIFIC DATA (RSVD)
200 Pin Unbuffered 1.8V
BYTE
47-61
64-66
68-71
73-90
95-98
128-
255
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
62
63
67
72
91
92
93
94
SDRAM DDR2
ADDRESS AND COMMAND SETUP TIME, (t
ADDRESS AND COMMAND HOLD TIME, (t
DATA / DATA MASK INPUT SETUP TIME, (t
DATA / DATA MASK INPUT HOLD TIME, (t
WRITE RECOVERY TIME, (t
WRITE to READ Command Delay, (t
READ to PRECHARGE Command Delay, (t
Mem Analysis Probe
Extension for Bytes 41 and 42
MIN ACTIVE AUTO REFRESH TIME, (t
MINIMUM AUTO REFRESH TO ACTIVE /
AUTO REFRESH COMMAND PERIOD, (t
SDRAM DEVICE MAX CYCLE TIME, (t
SDRAM DEVICE MAX DQS-DQ SKEW TIME,
(t
SDRAM DEVICE MAX READ DATA HOLD SKEW
FACTOR, (t
PLL Relock Time
Optional Features, not supported
SPD REVISION
CHECKSUM FOR BYTES 0-62
MANUFACTURER`S JEDEC ID CODE
MANUFACTURER`S JEDEC ID CODE (continued)
RESERVED
MANUFACTURING LOCATION
MODULE PART NUMBER (ASCII)
PCB IDENTIFICATION CODE
IDENTIFICATION CODE (continued)
YEAR OF MANUFACTURE IN BCD
WEEK OF MANUFACTURE IN BCD
MODULE SERIAL NUMBER
Open for customer use
DQSQ
PCB-Type (B82SRCF100-100)
)
S
1
QHS
Depth (2GB)
)
E
DESCRIPTION
2
N
3
Width
WR
Fon: +41 (0) 71 913 03 03
Fax: +41 (0) 71 913 03 15
02G
)
4
WTR
64
5
CKMAX
RC
)
)
RFC)
Data Sheet
DHb
RTP
IHb
)
DSb
C4
ISb
6
)
)
)
)
)
B
7
Chip organisation x8
6400-666
F
8
0x01 (Switzerland) | 0x02 (Germany) | 0x03 (USA)
0xD4
0x17
0x25
0x05
0x12
0x28
0x14
0x1E
www.swissbit.com
eMail: info@swissbit.com
Chip Rev. F
2
9
2 Module Rank
“SEN02G64C4BF2SA-xx”
SA
10
Chip Vendor (Samsung)
5300-555
-
0xDA
0x3C
0x1E
0x3C
0x20
0x27
0x17
0x00
0x06
0x7F
0x80
0x18
0x22
0x00
0x00
0x12
0x19
0x7F
0x00
0x52
0x00
0x00
0xff
Rev.1.2
25
x
x
x
11
DDR2-800MHz CL6
12
*
0x10
0x1E
*RoHs compl.
13
R
30.09.2010
4200-444
0x1E
0x9A
0x25
0x37
0x22
0x28
Page 13
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