LTC2871CUHF#PBF Linear Technology, LTC2871CUHF#PBF Datasheet - Page 34

• Manufacturer Part Number: LTC2871CUHF#PBF
• Description: IC, RS232-RS485 TXRX, 200MBPS, 5.5V, QFN-38
• Manufacturer: Linear Technology

Specifications of LTC2871CUHF#PBF

• Device Type: Transceiver
• No. Of Drivers: 2
• Supply Voltage Range: 3V To 5.5V
• Driver Case Style: QFN
• No. Of Pins: 38
• Operating Temperature Range: 0°C To +70°C
• Rohs Compliant: Yes
• Leaded Process Compatible: Yes
• Ic Interface Type: RS232, RS485

LTC2870/LTC2871
34
PACKAGE DESCRIPTION
4.50 ± 0.05
3.10 ± 0.05
2.50 REF
5.00 ± 0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
2.65 ± 0.05
0.50 BSC
PIN 1
TOP MARK
(NOTE 6)
0.25 ±0.05
3.65 ± 0.05
4.10 ± 0.05
5.50 ± 0.05
4.00 ± 0.10
(2 SIDES)
3.50 REF
(Reference LTC DWG # 05-08-1712 Rev B)
28-Lead Plastic QFN (4mm × 5mm)
UFD Package
0.70 ±0.05
0.75 ± 0.05
PACKAGE OUTLINE
0.200 REF
0.00 – 0.05
3.50 REF
R = 0.05
TYP
BOTTOM VIEW—EXPOSED PAD
3.65 ± 0.10
2.65 ± 0.10
R = 0.115
TYP
2.50 REF
27
28
R = 0.20 OR 0.35
× 45° CHAMFER
0.50 BSC
PIN 1 NOTCH
0.25 ± 0.05
(UFD28) QFN 0506 REV B
1
2
0.40 ± 0.10
28701f