MC34940EGR2 Freescale Semiconductor, MC34940EGR2 Datasheet - Page 3

• Manufacturer Part Number: MC34940EGR2
• Description: IC IMAGING DEVICE ELEC 24-SOICW
• Manufacturer: Freescale Semiconductor
• Type: Image Sensorr

Specifications of MC34940EGR2

• Input Type: Logic
• Output Type: Voltage
• Current - Supply: 8mA
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (7.5mm Width)
• Maximum Operating Temperature: + 90 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: 0 C
• For Use With: DEMO1985MC34940E - KIT DEMO FOR MC34940E FAMILY
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Interface: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Sensors
Freescale Semiconductor
Table 1. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
ELECTRICAL RATINGS
Peak V
Double Battery
ESD Voltage
THERMAL RATINGS
Storage Temperature
Operating Ambient Temperature
Operating Junction Temperature
Thermal Resistance
Soldering Temperature
Notes
1 Minute Maximum T
Human Body Model (C
Machine Model (C
Charge Device Model (CDM), Robotic (C
Junction-to-Ambient
Junction-to-Case
Junction-to-Board
1.
2.
3.
4.
PWR
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. In accordance with
SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MILSPEC 883 Method 1012.1) with the cold plate temperature used for the case temperature.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
Terminal soldering temperature limit is for 10 seconds maximum duration. The device is not designed for immersion soldering.
Exceeding these limits may cause malfunction or permanent damage to the device.
Voltage
(2)
ZAP
(3)
(1)
A
(4)
= 200 pF, R
ZAP
= 30°C
= 100 pF, R
ZAP
Rating
= 0 Ω)
ZAP
ZAP
= 1500 Ω)
= 4.0 pF)
Symbol
T
V
V
SOLDER
DBLBAT
V
T
PWRPK
R
R
R
STG
T
ESD
T
θ
θ
θ
A
J
JA
JC
JB
-55 to 150
-0 to 150
-0 to 90
Value
±2000
±1200
±200
26.5
260
0.2
3.0
40
41
Unit
°C/W
°C
°C
°C
°C
MC34940
V
V
V
3