SI3015-BS Silicon Laboratories Inc, SI3015-BS Datasheet - Page 62

• Manufacturer Part Number: SI3015-BS
• Description: IC ISOMODEM LINE-SIDE 16SOIC
• Manufacturer: Silicon Laboratories Inc
• Type: Enhanced Global Direct Access Arrangementr

Specifications of SI3015-BS

• Package / Case: 16-SOIC (3.9mm Width)
• Data Format: V.90
• Interface: Serial
• Voltage - Supply: 3.3 V ~ 5 V
• Mounting Type: Surface Mount
• Product: Modem Module
• Supply Current: 0.3 mA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Baud Rates: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Contains lead / RoHS non-compliant

Si3038
Rev 1.0 to Rev 1.1 Change List
Rev 1.1 to Rev 1.2 Change List
Rev 1.2 to Rev 2.0 Change List
Rev 2.0 to Rev 2.01 Change List
62
Typical Application Circuit was updated.
C24, C25 value changed from 470 pF to 1000 pF
and C31, C32 were added in Table 16 and Table 17.
In Table 17, the tolerance was also changed from
20% to 10%.
TSSOP information added.
Added note to Table 2.
Amended note 3 in Table 5.
Added China settings to Table 19.
Added “DC Termination Considerations.”
Figure 19, “Typical Applications Circuit for the Dual
Design Si3036 and Si3038,” on page 16 updated.
Table 16, “Global Component Values—Si3038
Chipset,” on page 17 updated.
Table 17, “FCC Component Values—Si3036
Chipset,” on page 18 updated.
Updated applications schematic (Figure 19) and
BOM (tables 16 and 17).
Added Appendix B.
Corrected transmit frequency response specification
to 0 Hz typical.
Updated “Overload Detection” section text
concerning CTR21 mode.
Removed CTRO bit (Register 64h, bit 7).
Updated Singapore DCT setting to DCT[1:0] = 10 in
Table 19.
Updated initialization section sequence (third item)
to “Write 0x0000 to register 3Eh...”
Table 19 updated.
“Appendix B—CISPR22 Compliance” updated.
The “Ringer Impedance Network” figure and the
“Component Values—Optional Ringer Impedance
Network” table were deleted from the “Ringer
Impedance” section as well as a paragraph
discussing Czech Republic designs.
The “Dongle Applications Circuit” figure was deleted.
Rev. 2.01