MCP23016-I/SP Microchip Technology, MCP23016-I/SP Datasheet - Page 30
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MCP23016-I/SP
Manufacturer Part Number
MCP23016-I/SP
Description
IC I/O EXPANDER I2C 16B 28SDIP
Manufacturer
Microchip Technology
Specifications of MCP23016-I/SP
Package / Case
28-DIP (0.300", 7.62mm)
Interface
I²C
Number Of I /o
16
Interrupt Output
Yes
Frequency - Clock
400kHz
Voltage - Supply
2 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Through Hole
Includes
POR
Logic Family
MCP23016
Propagation Delay Time
50 ns
Operating Supply Voltage
2 V to 5.5 V
Power Dissipation
1 W
Operating Temperature Range
- 40 C to + 85 C
Input Voltage
4.5 V to 5.5 V
Logic Type
I/O Expander
Maximum Clock Frequency
400 KHz
Maximum Operating Frequency
3.4 MHz
Mounting Style
Through Hole
Output Current
25 mA
Output Voltage
4.5 V
Chip Configuration
16 Bit
Bus Frequency
400kHz
Ic Interface Type
I2C
No. Of I/o's
16
Supply Voltage Range
2V To 5.5V
Digital Ic Case Style
DIP
No. Of Pins
28
Ic Function
I/O Expander
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP23016-I/SP
Manufacturer:
AirBORN
Quantity:
214
MCP23016
28-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
DS20090C-page 30
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A
A1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Lead Thickness
Foot Angle
Lead Width
N
1 2
b
D
Dimension Limits
e
E1
Units
A2
A1
E1
L1
N
A
E
D
e
L
c
φ
b
A2
E
1.65
0.05
7.40
5.00
9.90
0.55
0.09
0.22
MIN
c
0°
–
MILLIMETERS
L1
0.65 BSC
1.25 REF
10.20
NOM
1.75
7.80
5.30
0.75
28
4°
–
–
–
–
Microchip Technology Drawing C04-073B
© 2007 Microchip Technology Inc.
10.50
MAX
2.00
1.85
8.20
5.60
0.95
0.25
0.38
8°
–
φ
L