MCP23S08-E/P Microchip Technology, MCP23S08-E/P Datasheet - Page 23

• Manufacturer Part Number: MCP23S08-E/P
• Description: IC I/O EXPANDER SPI 8B 18DIP
• Manufacturer: Microchip Technology

Specifications of MCP23S08-E/P

• Package / Case: 18-DIP (0.300", 7.62mm)
• Interface: SPI
• Number Of I /o: 8
• Interrupt Output: Yes
• Frequency - Clock: 10MHz
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Includes: POR
• Logic Family: MCP23S08
• Propagation Delay Time: 50 ns
• Operating Supply Voltage: 1.8 V to 5.5 V
• Power Dissipation: 700 mW
• Operating Temperature Range: - 40 C to + 125 C
• Input Voltage: 1.8 V to 5.5 V
• Logic Type: I/O Expander
• Maximum Clock Frequency: 10 MHz
• Maximum Operating Frequency: 1.7 MHz
• Mounting Style: Through Hole
• Output Current: 25 mA
• Output Voltage: 1.8 V to 4.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: GPIODM-KPLCD - BOARD DEMO LCD GPIO EXP KEYPAD
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

2.0
Absolute Maximum Ratings †
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on V
Voltage on all other pins with respect to V
Total power dissipation (Note) .............................................................................................................................700 mW
Maximum current out of V
Maximum current into V
Input clamp current, I
Output clamp current, I
Maximum output current sunk by any output pin ....................................................................................................25 mA
Maximum output current sourced by any output pin ...............................................................................................25 mA
© 2007 Microchip Technology Inc.
†
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note:
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
ELECTRICAL CHARACTERISTICS
Power dissipation is calculated as follows:
P
DD
DIS
with respect to V
= V
DD
IK
OK
(V
x {I
DD
SS
I
(V
DD
< 0 or V
pin ..............................................................................................................................125 mA
O
pin ...........................................................................................................................150 mA
- ∑ I
< 0 or V
SS
OH
I
> V
......................................................................................................... -0.3V to +5.5V
} + ∑ {(V
O
DD
> V
SS
)...................................................................................................................... ±20 mA
DD
(except V
DD
) .............................................................................................................. ±20 mA
-V
OH
) x I
DD
)............................................................. -0.6V to (V
OH
} + ∑(V
MCP23008/MCP23S08
OL
x I
OL
)
DS21919E-page 23
DD
+ 0.6V)